Electronics Forum: pitches (Page 131 of 290)

Re: BGA on IPII

Electronics Forum | Mon Oct 30 13:26:09 EST 2000 | stefano bolleri

Ramon, I have placed BGAs before with an IP-2. It can be done, but with limitations: IP-2 can only see shape of BGAs, not balls (back-light only). Is this OK for you? I only placed components with balls having 50mil pitch, and the centering with bod

Re: Clamshell printers

Electronics Forum | Fri Aug 04 12:57:34 EDT 2000 | Steve Thomas

James, we used to use 3 clamshell type printers (one of which did have a two camera vision system, and did all our fine pitch), but had limited success with 20 mil pitch. 25 mil pitch was no problem. I suspect that you'll find people that have had

Placement accuracy

Electronics Forum | Wed Feb 07 20:57:31 EST 2001 | Kyle

What are you placing on this equipment? If you are placing flip chips, you need to have a glass plate test system to verify your machine is accurate and repeatable. If you purchase new equipment and plan to place flip chips or ultra fine pitch, it

Manual Stencil Alignment

Electronics Forum | Wed Jun 27 21:24:47 EDT 2001 | davef

Welcome. First, proper alignment can produce an order-of-magnitude increase in the number of boards that can be printed without wiping. The initial alignment can be made either by: * Peering through the stencil apertures at the board underneath and

Re: Product Segmentation in Pick Place Machines?

Electronics Forum | Sat Sep 11 13:44:48 EDT 1999 | Dean

| Okay guys (and my fellow lady lurkers), I am trying to determine WHAT the segmentation is for the products in the pick and place industry. | | For example, I know in screen/stencil printing, there are manuals, there are semi-automatics, mid- and h

Re: solder mask between qfp pads

Electronics Forum | Mon Aug 16 04:47:04 EDT 1999 | Charles Stringer

| | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact wit

Re: Paste Printing @ 45 degrees

Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A

It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu

Re: 20 mil qfp bridging

Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F

| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi

Re: BENT LEADS ON FINE PITCH

Electronics Forum | Tue Apr 13 04:54:53 EDT 1999 | Charles Stringer

| | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | I use tweezers and picks. I place the component down on it's backside (legs up) and manually twe

Re: BENT LEADS ON FINE PITCH

Electronics Forum | Tue Apr 13 12:36:57 EDT 1999 | Scott McKee

| | | DOES ANY ONE KNOW HOW I CAN STRAIGHTEN | | | BENT PINS ON A FINE PITCH QFP WITH OUT DAMAGING | | | THE CHIP. AT $300 A CHIP I CAN'T SCRAP THEM. | | | | | I use tweezers and picks. I place the component down on it's backside (legs up) and ma


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