Electronics Forum | Wed Dec 19 09:56:20 EST 2001 | guicho_v
I'm new in SMT world, and I've got my 1st challenge: I'm having de-wetting issues with a specific IC 160 pins MQFP (six location, failure is random), where one pin has de-wetting (solder reflow OK, and there is evidence of having contact the past and
Electronics Forum | Sat Aug 10 06:38:25 EDT 2002 | jojojameson
Dear Freinds, We are having 18000 sqfeet airconditioned space for pcb contract manufacturing.We had chipschooters,through hole machines & fine pitch placement machines with international standard.In addtion we had clean rooms & wire bond facilities.W
Electronics Forum | Wed Jan 16 07:49:14 EST 2002 | Yannick
Hi, In few weeks I want to test the capabilities of our SMT Line. To do that I'll design a board. I want to test: - The Printing - The component placement - The soldering - Different stencil aperture - Mixed Technology (Thr
Electronics Forum | Sat Feb 02 23:16:17 EST 2002 | caldon
STIMPMAN- Dave is correct Teflon has to be going somewhere. Solder is also expensive and to be dragging it around the fingers on your machine is not cheap either. (I am sure Debbie could recomend a reclain system ). Some times the pain is either fron
Electronics Forum | Sun Feb 24 13:52:47 EST 2002 | bentzen
Hi Armin Printing equipment can be divided into two main groups; In-line and off-line. For "small" production sites an off-line screen printer should be adequate but for high out-put placement lines, where the product cycle-time is short, an in-line
Electronics Forum | Sun Apr 14 14:13:25 EDT 2002 | davef
I assume you're looking at stencil fab equipment because you need 'faster turns' than you can get from available stencil suppliers. While you're assessing this, consider other alternatives, such as: * Dispensing paste. [A very funny SMTNetter, livin
Electronics Forum | Fri Apr 19 07:50:24 EDT 2002 | pjc
I used to build flash memory products for M-Systems. Up to 30,000 per week. Nothing special in the process for these boards. 1mm and 0.4mm thick std. FR4 PCBs are used. Double-Sided reflow. The 0.4mm thin boards require process carriers. Panelized 24
Electronics Forum | Tue May 14 14:59:47 EDT 2002 | fmonette
Greg, As Dave pointed out, the main reason to bake components is to remove absorbed moisture from moisture-sensitive components. All you need to know on this subject, including the specific bake conditions (temperature and duration) are clearly s
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Tue May 14 20:25:02 EDT 2002 | russ
Hello All, I've got a little problem here. I have a 456 ball PBGA 1mm pitch, .5mm balls, with .6mm pads on the board. given that the pad size is way to big (S/B .45mm or so)I need any and all advice on how to rework these things without shorting o
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