Electronics Forum | Tue May 01 13:25:20 EDT 2001 | kaoni
Thank you Wolfgang, My time table is the amount of time it takes to get it right. I hope to have product by next December if possible. Yes, I am starting from ground zero. I need to go 201 because of the size limitations as to what I need to fit in
Electronics Forum | Sat Jul 03 01:09:29 EDT 1999 | DEAN
| | I am currently looking into ways to decrease SMT changeover times. I work in a high mix-low volume factory. We use Fuji CP's and IP's for SMT production. I would appreciate hearing from anybody that has some proven methods for reducing setup/chan
Electronics Forum | Sat Jul 03 13:49:36 EDT 1999 | JohnW
50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c
Electronics Forum | Wed Jun 02 15:05:59 EDT 1999 | JohnW
| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro
Electronics Forum | Sun May 30 18:34:04 EDT 1999 | Earl Moon
| | | | | | Is it possible to place parts that do not have leadframes exposed when looking from the top side of the part such as BGA's using a Fuji IP1 with a SMD1 vision (Binary) system. I realize that the IP1 does not have front lighting but accord
Electronics Forum | Wed Nov 18 11:03:45 EST 1998 | Scott Lolmaugh
| | | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to
Electronics Forum | Tue Sep 22 10:57:05 EDT 1998 | Jim Price
| | | | | | | | | | | FujiCam users | | | | | I am looking for any feedback concerning Fujicam. | | | | | User friendly? | | | | | Any Bugs? | | | | | Any input would be nice | | | | | Mike | | | | Mike, | | | | While I don't have any experience
Electronics Forum | Thu Oct 01 16:43:24 EDT 1998 | Mike Demos
Thanks for your reply! I do appreciate your response. I received some information from the company that sells Accuspec, but I hadn't heard from any users yet. Your sales pitch sounds on your unit sounds tempting, but I'll have to pass on your Ac
Electronics Forum | Thu Jun 25 09:08:14 EDT 1998 | Russ Miculich
Thought I'd jump in as I helped develop materials for the FC game. Au/Pb - bumping - talk to Hughes Tuscon about this. They do it and will discuss the process. For Flip Chip Technology here in the States - contact Peter Elenius at Flip Chip Techno
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
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