Electronics Forum | Wed Feb 02 08:51:25 EST 2005 | Dougs
we have a capacitor cracking on one of our boards, there are four of the same cap on the board and only one cracks, we are seeing about 6% of the component cracking. it's not near the edges of the board and he board is 2.4mm thick so i dont think it
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Fri Mar 24 15:40:23 EST 2006 | Gilligan
Novemer 13, 2001, minutes from the JG-PP Lead-Free Solder project: http://www.jgpp.com/projects/lead_free_soldering/minutes/01novminutes.pdf It seems to me, that although everything was discussed before hand, it wound up being the "Let's do it and
Electronics Forum | Thu Nov 16 11:45:15 EST 2006 | markb
I still think the best bet is probably an SMT pre-bake operation to ensure that there is no moisture in the board. Vapor pressure is usually the leading cause for delamination, so removing the source should significantly help out. Unfortuantely, pr
Electronics Forum | Mon Aug 13 10:51:14 EDT 2007 | davef
This sounds like sales-type teaser posting, but let's see what we get. When comparing convection to IR BGA rework stations, IR stations perform poorly when: * Evaluation board has no power and ground planes. Worst case PWB as IR energy from bottom h
Electronics Forum | Thu Oct 16 11:15:53 EDT 2008 | davef
A good solder connection with heavy ground plane requires: * Plenty of heat [Is the preheater located too far from the wave? Whenever you look at board temperature, there is a sharp decrease in temperature between the preheater and the wave.] * Conta
Electronics Forum | Thu Oct 21 02:31:27 EDT 2010 | rok
OGER 4003C bounding to Aluminum I am hoping someone might have the solution to my problem I have the following PCB: RO4003 Thickness: .2mm Layer: top single/ bottom ground plane Finish: silver top and bottom .2um Size: 3mmx6mm I need to bound/groun
Electronics Forum | Thu Feb 12 10:06:00 EST 2015 | rgduval
Funny, I just had this discussion on LinkedIn. Must be the season. It is always acceptable and preferably to profile every assembly, if you have the time, resources, and equipment to do it. That is the only way to get the most accurate information
Electronics Forum | Thu Aug 13 16:57:32 EDT 2020 | rgduval
Is that no solder on the left hand pins in the picture? If so, it could be a directional thing. Have you tried turning the board 90º or 180º from the current direction of travel? Not a huge fan of wave solder for SMT components personally, though,
Electronics Forum | Mon Apr 23 10:02:47 EDT 2001 | Cal
Mydata machines are great for large back planes close to 23" wide. The foot print of the Mydata machines are concerning- being a "T" design it sacrifices floor space. Also, Mydata is not considered to be in the same classification (my opinion) of equ
