Electronics Forum: plated (Page 221 of 260)

Re: copper land delamination

Electronics Forum | Mon Nov 15 21:35:50 EST 1999 | Dave F

Bob Bob: Fortunately, you found this before you built-up a lot of product. Some thoughs and other drivel: 1 Use IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical pad peel strength requirement for FR-4, 2 oz. copper is: 6 l

Re: Dull Solder

Electronics Forum | Fri Nov 12 10:00:42 EST 1999 | Dave F

Edmund, following-on from Wolfy: Back in the old days, anyone who could spell "sodder" considered "bright and shiny connections" GOOD and "dull and grainy connections" BAD. Now, "dull and grainy" connections can be either GOOD or BAD, depending on

Re: ESD mats

Electronics Forum | Wed Oct 27 17:27:58 EDT 1999 | John Thorup

well... it might be cheaper. But I think it's a bad idea. First, your operators will hate you by the end of the day with their sore feet, not to mention lost productivity. Second, safety. Even if the plates are connected to ground through a resistor

Re: 0402's Tombstoning

Electronics Forum | Thu Oct 14 18:02:31 EDT 1999 | JohnW

Bryan, 0402's tombstonning isn't that uncommon and usually the 1st reaction is alway's the pad size aint right. If you've followed the IPC guidline's normally you should be fine but I'd double check the component supplier's spec's as well. brian's p

Help! 2-layered Thru-Hole PCB Solder Mask/Soldering Problem

Electronics Forum | Wed Sep 29 23:54:07 EDT 1999 | Dreamsniper

Hi everyone, Greetings! I�ve got a 2-layered through-hole PCB�s having the following problems: Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB Insufficient Solder and some solder never make it to t

Re: Contamination causing shorts.

Electronics Forum | Sat Sep 25 07:07:02 EDT 1999 | Brian

| I need a memory jog. What is the term for the growth of conductive contamination after a board is in storage or field? | There are several different mechanisms which can cause this. In reality, ionic contamination is the root cause for many of the

Re: PCB Support Methods @ the Fuji.

Electronics Forum | Wed Sep 22 20:57:46 EDT 1999 | JAX

| | Question for you SMT guru's out there. | | | | What is the best way to support boards on Fuji's CP6 machine's x-y table...particularly for 2nd side SMT where the support side already has parts... I am toying around with the following methods: |

Re: Soldering to Gold

Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F

| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re

Re: Time to use alternative finishing ???

Electronics Forum | Fri Sep 10 15:32:30 EDT 1999 | Earl Moon

| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with

Re: how to overcome tolerance in automatic alignment

Electronics Forum | Thu Sep 09 09:13:10 EDT 1999 | Scott Cook

| hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the precis


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