Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef
SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep
Electronics Forum | Sat Jan 26 21:33:39 EST 2013 | sarason
Looks like you have a carbon black process that isn't quite plating to completion, pin prick size holes have remained in the plating. When dipped in an etchant (ie any acid or H2O) the holes grow and they leak carbon. This may be more of a problem th
Electronics Forum | Mon Aug 23 11:27:00 EDT 1999 | Dave F
0.6 �m (25 micro inches) and self-limit around 5 mils depending on the material being plated and the process. Similarly with white tin, laminates with cleaned copper are immersed in a series of tin baths without an external source of electric curren
Electronics Forum | Mon Feb 22 14:02:17 EST 1999 | Michael Allen
We have resorted to adding a ring (or donut) around our 0.040" round fiducials. The donut acts as a "plating thief" to minimize the thickness of the copper plating (in the case of HASL finish) and of the solder plating (in the case of solder-plated
Electronics Forum | Tue Sep 30 21:00:41 EDT 2003 | davef
We're not clear on what you seek. So, as a starting point for our discussion, we wouldn't get agitated if we saw "routine" coplanarity of 4 thou. For instance: Maximum Lead Coplanarity [Altera] Package||Acronym||Lead material||Finish||Maximum Lead
Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef
If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio
Electronics Forum | Fri Oct 14 11:56:49 EDT 2005 | patrickbruneel
Mika, 1.) Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? Answer: The thicker the board the further the solder has to travel and the more you depend on solderability of boards and components, machine
Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1
Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us
Electronics Forum | Mon Feb 19 22:56:20 EST 2007 | davef
Russ We agree with your comments on plugging from one side only. But... We believe that it IS possible to trap process chemicals [technically, not flux] in a blind [or any other] via. This can be done by plating the via closed, rather than pluggi
Electronics Forum | Wed Feb 23 21:37:31 EST 2000 | Morris
Michael: I would agree with Jason. It seems your analysis has pointed you to one specific brand of part. I've also seen this phenomenon. The part was Palladium plated and when we switched to a nickel/tin plated part, the problem went away. Some o
