Electronics Forum | Tue Jan 26 09:33:24 EST 2010 | smt_guy
Hi, I have a copper plate that we received from supplier with oils and some sort of stains. We tried most of the general type of degreasers by soaking but didn't work until we tried a Floor Stripper from Ace and it does make the copper clean and shi
Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist
Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re
Electronics Forum | Thu Jun 17 10:22:51 EDT 2010 | floydf
Last July I posted a query about reflowing leaded paste to gold plated boards, I wasn't getting a good reflow. The answer that seemed to work was dwelling the board at reflow for the maximum recommended amount of time. Would anyone have an opinion on
Electronics Forum | Tue Sep 14 10:10:39 EDT 2010 | teamcanada
We are having an issue with a PCB supplier. Their Tin HASL layer seems to be the problem. We have triedworking with them to correct their process. What seems to have helped is lowering their temperature of the Tin dip from 540 F to 510 F.We still ha
Electronics Forum | Wed Jan 19 11:44:47 EST 2011 | davemac62
I have a Topaz with 2 positions in the rear where component trays may be placed for limited tray component capability. There is not a lot in the manual on how to set this up. The Feeder Plate info is set up to allow Fix.tf. I have spec'd tray - fix.t
Electronics Forum | Thu Jan 20 00:22:07 EST 2011 | yangloh
Dear Industry experts, We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc) We intend to explore electronics and
Electronics Forum | Mon Mar 21 17:36:44 EDT 2011 | davef
Kim: You could be correct. We had a batch of BGA that had a weird bridging pattern. Could not figure it out. So, we put the whole batch straight out of the 'box' bug-up on a hot plate and video recorded the balls as we took them through a thermal cy
Electronics Forum | Thu May 12 18:32:02 EDT 2011 | jbaez1
Also... this is ONLY a pick issue? No issues with > placement for those that you do successfully > pick? > > Have the spindles been calibrated > lately? Hi Vickt! thanks for your comments,,during step mode no failure at all, the spindle moves d
Electronics Forum | Tue May 31 22:40:24 EDT 2011 | bejrananda
HI All, Please kindly advice me, I have project that it has DPAK part (MPN:SUD25N15-52 E3 Plating:100% Sn matte)which locate on bottom side (1st reflow), Good wetting for 1st reflow.. but .. when I run Top side (2nd reflow).I found that this D
Electronics Forum | Fri Sep 16 08:01:06 EDT 2011 | davef
We see no advantage to extending the toe-end of pads. Hell, 90 percent of the time the numb-end of the toe of the component lead isn't plated. So, it doesn't take solder. Further, solder on the toe adds little, if anything to the strength on the sold
