Electronics Forum: plating (Page 176 of 252)

Re: Soldering to thru-hole lead to ground plane without thermal relief

Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.

IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet

Re: WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F

Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor

Re: Hot Air Knife

Electronics Forum | Mon Mar 13 14:41:22 EST 2000 | Boca

By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it

Re: Hot Air Knife

Electronics Forum | Mon Mar 13 14:45:01 EST 2000 | Boca

By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it

Re: Current capability

Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F

Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,

Reflow Power Failure

Electronics Forum | Mon Feb 28 03:46:34 EST 2000 | Hany

Hello 1-In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money to buy a UPS for a reflow oven. One

Reflow soldering through hole parts

Electronics Forum | Tue Jan 30 01:32:24 EST 2001 | PeteC

Bill, We do solderpaste reflow on through-hole here every day on plated-thru-holes. We do it on connectors only. It is a reliable process. We use no special profile. The stencil apertures must be modified for this process. Check out the IPC-7525 "St

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Routing feedrates for PCB�s

Electronics Forum | Sun Mar 18 20:48:23 EST 2001 | Doug Leaser

I�m doing some research in the field of routing, or cutting, PCB�s using a non-conventional method as compared to conventional routing machines. I need some accurate feedrates for routing certain PCB materials, as listed below, to compare data. Unf

Electroless Nickel/Gold finish

Electronics Forum | Tue Apr 17 10:17:10 EDT 2001 | genny

Hi, ENIG finish is the same reason I came to this forum for the first time a few months ago. I found a bunch of useful information by searching the archives. Check it out. ENIG has some good properties like flatness, and the process control has i


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