Electronics Forum | Wed May 27 10:15:52 EDT 1998 | Doug Romm
Just wanted to add a few comments on the discussion of how to identify palladium parts. Generally, there is no "clear-cut" way to identify Pd versus Sn/Pb. It mainly comes with experience. Any part that is is plated prior to being trim/formed will
Electronics Forum | Wed Mar 25 16:38:21 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no issue with .030" solder balls, since the actual volume of the .002" via in pad is small compared to the ball+solder paste volume. We did notice random bubbles where, apparently, the sol
Electronics Forum | Wed Mar 25 16:36:10 EST 1998 | Steve Joy
We have successfully put .016" vias in .030" pads. There is no drain off with .030" solder balls, since the actual volume in the .002" depression is low. We did notice random bubbles where, apparently, the solder reflowed and trapped the air in the
Electronics Forum | Wed Mar 25 19:41:01 EST 1998 | Earl Moon
| We have successfully put .016" vias in .030" pads. | There is no drain off with .030" solder balls, since | the actual volume in the .002" depression is low. | We did notice random bubbles where, apparently, the | solder reflowed and trapped the a
Electronics Forum | Wed Aug 22 22:22:52 EDT 2001 | davef
First an administrative point, you can edit the postings that you make on SMTnet. Look for the yellowish-greenish EDIT button at the top of your posting. Second there are over 170 postings on intermetallic* on the fine SMTnet Production Forum Archi
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Wed Jan 30 17:44:38 EST 2002 | davef
The gold is compatible with your solder. Gold will dissolve in your solder very quickly. Assuming you have a fairly large [~ couple hundred pounds] solder pot, the gold will not, over the short term, affect the performance of the pot. The issue is
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Tue May 07 15:24:13 EDT 2002 | gregp
I believe Mitutoyo makes a CMM for that application. They were soliciting the idea at APEX show a couple of years ago. I believe they were going to develop some software to do just what you are asking for (following the IPC-9850 format). A CMM, ho
