Electronics Forum | Thu Jun 04 15:41:07 EDT 1998 | Chrys
| If you could measure and chart 3 variables in my process, what would they be? | The boards that I produce are on panels that are 12up and 2x4 up. All boards are single sided paper base w/o plated thru holes. They are on scored panels that measure
Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson
| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus
Electronics Forum | Mon May 18 21:29:38 EDT 1998 | D.Lange
| I've tried every thing I can think of. Do you have any | Ideas? | What I have is micro balls on the gold fingers of | panelize boards. These balls only appear on the gold | finger. Or at least I can only find them on the gold | fingers. | What I
Electronics Forum | Tue May 19 12:29:59 EDT 1998 | Richard Jackson
| Richard, | You may be encountering solder paste contamination | on the assembly during the printing process. Solder | will reflow on tin/lead plated lands therefore invisible. | If you are washing the assembly prior to inspection | then you are
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Wed Mar 25 19:31:13 EST 1998 | Earl Moon
| | We are having some problems with "drawbridging" on 0805 film capacitors. | | We have already reduced the pad width from .050" to .040" based on input | | from vendor. Defects appear to be random as far as location on the PWB and direction | | o
Electronics Forum | Sun Mar 29 15:42:05 EST 1998 | Michael Fogel
| | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | We have already reduced the pad width from .050" to .040" based on input | | | from vendor. Defects appear to be random as far as location on the PWB and direction
Electronics Forum | Mon Mar 30 07:44:12 EST 1998 | Earl Moon
| | | | | We are having some problems with "drawbridging" on 0805 film capacitors. | | | | We have already reduced the pad width from .050" to .040" based on input | | | | from vendor. Defects appear to be random as far as location on the PWB and d