Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Mon Apr 21 16:38:45 EDT 2014 | barryg
Hello all. We have been having some problems soldering to what we believe is a nickel plated spring steel battery terminal to a PCB. We have tried scrapping , then tinning, dipping and still have problems. Are there any special fluxes or pre-treats t
Electronics Forum | Thu Dec 11 09:27:16 EST 2014 | sreejhu
ALso, coming to the convection the DIMA service group said : "Its full convection in the top zones. The bottom zones are heating elements mounted underneath a thick aluminium plate. So not full IR, but the head is coming from the heated aluminium p
Electronics Forum | Tue Feb 16 20:32:57 EST 2016 | davef
George Milad is the Head of the IPC IPC Plating Committee 4‐14. The IPC Plating Committee 4‐14 is developing the IPC-4555 OSP Finish Specification. He can give the best advice. Contact George [George Milad, National Accounts Manager for Technology, U
Electronics Forum | Wed Dec 14 20:17:48 EST 2016 | davef
As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not. If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system
Electronics Forum | Fri Oct 26 05:03:17 EDT 2018 | farouk225
Hi everybody, I have a question about the minimum distance to leave beteween a non non-plated mounting hole with copper pads and the edge of the PCB. Is there any formula or rule to apply ? For example for a hole of diamater equals to 5.6mm which
Electronics Forum | Fri Jul 19 13:02:01 EDT 2019 | davef
Double-check me on this, but I don't believe that A-610 [IPC-A-610] requires side fillets on QFN solder connections, because the sides of most terminations are not plated. Plating on the bottom of the termination is sufficient for a proper solder con
Electronics Forum | Wed Jun 17 14:29:06 EDT 2020 | emeto
These are great pictures. I have never seen this kind of solder repelling from the pad. My number one suspect now is the PCB. Your focus should be on board plating and contamination. The easiest test is to have meaningful batches from another board h
Electronics Forum | Fri Jan 22 13:22:18 EST 2021 | davidhillman
Hi Graham - brite acid tin gets it "shiny" appearance due to codeposited organic material in the tin plating. The codeposited materials volatilize during the soldering process causing a ton of voids. Brite acid tin plating should not be used as a sol
Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr
Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi
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