Electronics Forum | Thu Jun 24 23:57:42 EDT 2004 | George
Could anyone tell me the difference in PCB material Nelco13 and FR4? PCB dielectric material Nelco13 is quite new for me and I knew nothing about it. For imcoming quality control (IQC), I am asked to identify PCB made of FR4 and Nelco13. How to do th
Electronics Forum | Mon Jun 28 01:44:02 EDT 2004 | George
Thanks a lot !
Electronics Forum | Fri Jun 25 07:13:40 EDT 2004 | davef
Nelco was developed by Park [ http://www.parknelco.com/parknelco/highspeed.htm ] Without fairly involved testing, you may be forced to rely on a c of c from your fabricator. Although, Park may be able to give you a lead.
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
Electronics Forum | Wed Jun 12 20:04:03 EDT 2002 | scottxiao
Thank you very much!
Electronics Forum | Thu Jun 20 04:49:34 EDT 2002 | scottxiao
according to the ressult of cross-section and removing the component, I find there is no black area in the left pad, and the IMC is also normal, so the black nickle is less impossible. the PCB material is not common FR4, just some thing like ceramic,
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul
I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Wed Feb 26 21:44:52 EST 2003 | Paul Dansereau
I will be building a board, about 8 X 12 , .062" thick using a standard FR406 stackup. It has a variety of devices, including CCBGA , CBGA and PBGA's. Given the challenge of developing a reflow profile that will accomodate both ceramic and plastic BG
