Electronics Forum: pop (Page 1 of 35)

solder pop out from via hole at secondary reflow

Electronics Forum | Tue Jul 09 00:11:42 EDT 2002 | yngwie

Thanx Dave F.

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie

Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 14:41:17 EDT 2002 | davef

See what happens when you take a couple of days off? Your theory sounds reasonable, but someone else could make an equally valid case that you are blasting your solder plug across the room with the force of the expansion of entapped air between th

SMT Disasters

Electronics Forum | Mon Jul 07 10:31:27 EDT 2008 | realchunks

Yeah, I burned my Pop-Tarts* this morning. Someone turned the knob on the cafeteria toaster oven. Gotta check them knobs no matter where ya go. (* = Poster has no affiliation with Pop-Tarts or Pop-Tarts products)

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 07:51:16 EDT 2011 | a

C-SAM is a non-destructive alternative that a lot laboratories and chip manufacturers use. Dye and Pry would work I suppose although I have never done it in practice with PoP but it should be any different for PoP.

PoP parts

Electronics Forum | Tue Apr 15 18:49:37 EDT 2014 | hegemon

Evtimov, Are you talking about placing an already built POP package, or about building the POP package at the SMT line? 'hege

PoP parts

Electronics Forum | Wed Apr 16 19:17:11 EDT 2014 | hegemon

OK, POP already done, and you are mounting the POP device. You are seeing opens. Opens at the device/PWB? or opens at the device/device interface? Or possibly both? 'hege

Thermo-couple attachment

Electronics Forum | Wed May 07 09:53:39 EDT 2003 | cyber_wolf

Thanks for the response Dave. FYI: In my experience using the light cure adhesive, I have found that the newer the adhesive is the less prone it is to popping off during a reflow cycle. Also I have found that it only takes a very small amount to sec

Package On Package Problems

Electronics Forum | Wed Aug 22 02:50:59 EDT 2012 | robertwillis

Are you having any process problems with Package On Package Assembly? If so why not spend a few hours with the POP Team at SMTA International? You have a great opportunity to see, hear and experience POP in October. However if you really can't join

Immersion Silver

Electronics Forum | Wed Nov 06 13:01:54 EST 2002 | cvrgirl

Hi, Has anyone experience BGA caps/plugs popped off after assembly on a double sided board? Only the caps on the primary side popped off and exposing copper. thanks! Michelle

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