Electronics Forum: pop (Page 21 of 34)

Re: Rework Equipment

Electronics Forum | Mon Feb 28 19:36:39 EST 2000 | Tony

I work for a contract manufacture of PCB's, we are also in the BGA rework business. We see all kinds of different size boards, as well as different types of BGA's and micro BGA's. We selected the Conceptronics Freedom 2000 over the Air Vac and SRT. T

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc

Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

Re: Solder Balls on 0805 capacitors

Electronics Forum | Tue Jul 04 16:13:09 EDT 2000 | TOOLMANTIM

HELLO BILL I HAVE SOME QUESTIONS FOR YOU 1:HOW ARE YOU CLEANING YOUR STENCIL 2:ARE YOU SINGLE OR DOUBLE PRINTING. 3:ARE YOU USEING VACUUM FIXTURES OR NOT? HERE ARE SOME OTHER THINGS TO TRY. IF YOU ARE CLEANING YOUR STENCIL OFTEN BECAREFUL OF USEING

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 16 18:00:50 EST 2001 | mikestringer

Hi everyone I am in the process of reviewing our storage of SMT components. At the moment they are pretty much on open shelves in the factory environment. We endevour to reseal components labled 'moisture sensitive' in their original packaging, bu

Wave Soldering Ceramic PCB's - a result

Electronics Forum | Wed Aug 15 06:16:30 EDT 2001 | JohnW

Ok so an update on the ceramic board. I've had some success but did have to cheet a little. So Dave, on the fluxing, your right we're not getting it all the way up the barrel and in the end as a short term fix we're dipping the lead's in flux not th

blocking off stencil apertures with tape

Electronics Forum | Wed Oct 10 13:49:12 EDT 2001 | stepheno

I recently started at a new company. They have a variety of bare PCB's and most have aprox. 20 variations. Maybe about 1/3 of each board on average are non-populated locations. They buy one stencil for each PCB but then use scotch tape to block of

Baked Components

Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon

I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot

Immersion Silver

Electronics Forum | Wed Nov 06 20:18:30 EST 2002 | davef

cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see copper indicates you did no soldering, got no wetting, produced no intermetallics, etc. Tell us again which components did not solder? Wuzzis "plug" t


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