Electronics Forum: popping (Page 16 of 36)

Re: Flux sprayer set up

Electronics Forum | Tue Dec 21 13:27:47 EST 1999 | Vince Whipple

Charlie: As far as setting up a spray fluxer.. Are you spraying no-clean, voc free, water soluble? What you would want to do is to run a blank pcb through the fluxer and pop it out before the preheaters. Visually inspect for variations in uniformit

Solder Balls

Electronics Forum | Wed Nov 10 17:39:34 EST 1999 | Dave Vulcano

Hello, Looking for some insight. We just finished a run and experienced a lot of solder balls. We used a no clean paste, nitrogen atmosphere reflow oven, and saw the solder balls on 1206 - 0805 chip components. All of the solder balls appeared and

Re: Solder Balls

Electronics Forum | Thu Nov 11 14:55:23 EST 1999 | Dave F

Dave: I think you�re correct. The solder balls are probably from either: � Excessive paste � OR � Paste "exploding/popping" during reflow � OR � Some other variable. Two things: 1 It�s virtually impossible to determine the cause of your ball gen

SOT-23's Stencil Geometry

Electronics Forum | Wed Oct 06 10:31:05 EDT 1999 | Chris May

Hopefully, everybody suffers from solderability of SOT-23 devices and I would like to know how everybody else resolves this problem. Historically, here, we have always gone for 6 thou stencils. I found that going to an 8 thou stencil improved the sit

Re: Profiling on populated or unpopulated board?

Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon

| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc

Wave Soldering Ceramic PCB's - a result

Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW

Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall

BGA Solder joint appearance for the Motorola 860

Electronics Forum | Sat Jan 05 10:21:29 EST 2002 | Todd Murphy

Has anyone ever had any solder related problems with the Motorola 860 BGA? We are currently using the 860 on several of our products and some of the solder joints for the 860 look like crumpled aluminum foil when viewed with the Ersa Scope. Does anyo

Intrusive Reflow

Electronics Forum | Thu Nov 28 20:00:42 EST 2002 | iman

ran an internet search on "intrusive reflow", out popped various links on the subject. Bob Willis was rather prominent on the topic's links. anyway seems intrusive reflow soldering specs are the same as conventional manual insertion (radial, axial)

Epoxied Parts Falling Off

Electronics Forum | Wed Mar 26 22:17:09 EST 2003 | dlkearns1

I Like your analysis here. I dunno the whole story, but I've tracked parts popping/falling off to the metalazation of the parts, from various suppliers, as most suppliers have some type of pre-tinned coating on the leads.(not that this means anything

Email Links Work!!!

Electronics Forum | Fri May 23 16:05:20 EDT 2003 | davef

I hesitate to go very far with this, since Brian cannot defend himself. He's napping. A thumbnail: * We're talking about the ability to click on a link for an email address that someone included in a posting, have that link pop-up an email dialog,


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