Electronics Forum | Tue Oct 12 15:20:44 EDT 1999 | Jim Schultz
I need your help! We have been doing double sided surface mount for 4 years now. Up until 6 months ago I have not had a tombstoning problem. Since then I have a fairly high incidence rate of tombstones on the 0603 size resistors (no other parts).
Electronics Forum | Thu Oct 14 10:49:13 EDT 1999 | Dan Woodward
Andrew, As I read about issues with reworking connectors, whether they are surface mount or PTH soldered, I wonder if compliant pin pressfit connectors are being considered. They are easily assembled after all SMT without any thermal input, and on e
Electronics Forum | Sat Jun 19 11:44:00 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either at
Electronics Forum | Wed Jun 16 08:56:34 EDT 1999 | Vic Lau
Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,either a
Electronics Forum | Thu May 13 20:38:32 EDT 1999 | lima
Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? My concern is the volatiles in my WS629 solder paste may be attacking th
Electronics Forum | Mon Apr 19 08:50:46 EDT 1999 | J.H.
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 14:38:01 EDT 1999 | Chrys Shea
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Mon Apr 19 22:52:59 EDT 1999 | Dean
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Tue Apr 20 23:18:48 EDT 1999 | KEVIN SIMPSON
25 PPM)! | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate fo
Electronics Forum | Thu Feb 18 17:06:33 EST 1999 | Dave Jurena
| Hope some of you out there can help me with this one. | I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they
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