Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
Electronics Forum | Tue Sep 12 11:55:30 EDT 2000 | Mike F
In general I agree with Dave and Chris, but some parts have leads that can't be clinched (connectors, some header sticks, etc.). If the problem part has not been a floater in the past, then check the lead finish and your flux application. A bad finis
Electronics Forum | Wed Feb 02 21:17:55 EST 2000 | Steve Harshbarger
Istvan, The advise from both Roni and Mike sounds right on the money. The problem is most likely that your PCB is not completely dry (the flux has not completely evaporated) in the area where these solder balls occur. You have a number of differen
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
Electronics Forum | Thu Dec 16 16:46:47 EST 1999 | Mike Naddra
Steve , I use a general set of guidlines when developing reflow profiles: Ramp rate to 140 deg C - 50-60 seconds Time at preheat (140-160 deg C) - 90-120 sec Time above liquidous (183 deg C) - 45-90 sec Time at peak (215-225 deg C) - 9-12 sec peak t
Electronics Forum | Tue Sep 07 12:51:02 EDT 1999 | Brad Kendall
| | We are assembling double side pcs reflowing (smt) on top and by wave on bottom. | | After first step (smt) we dispense glue on the bottom side putting one or two glue dots under small components and we cure in oven before wave. | | After wave so
Electronics Forum | Tue Jun 15 04:55:00 EDT 1999 | Brian Ellis
The other answers on this thread are realistic but it also depends: a) on the quality and finish of the components and PCB (including, of course, solderability) b) the flux type (I would expect lower defect rates with water-soluble than with the less
Electronics Forum | Wed May 26 13:30:58 EDT 1999 | JohnW
| we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any obv
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
Electronics Forum | Wed May 12 17:37:08 EDT 1999 | Timothy O'Neill
| I am looking for anyone who has converted over to VOC Free flux. I need some info on any problems, etc. that you might have had. | | Please E-mail me at wes.ruggles@vickers-systems.com or call at (513) 494-5229 | | Thanks | Wes Ruggles | Hi Wes
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