Electronics Forum | Thu Sep 02 11:50:58 EDT 1999 | ScottM
| Could someone shares their experience on the causes of 'Open' in the BGA after reflow. | | Insufficient solderpaste. "No flux" (sat too long after print). Those are what I've experienced. Cheers, Scott
Electronics Forum | Fri Aug 20 15:33:02 EDT 1999 | Mark
Has anybody run across a good concise book or other source on solder paste, its characteristics, handling, storage, stencil design, printing and reflow? Yes I asking for the world! TX Mark
Electronics Forum | Fri Aug 20 11:19:47 EDT 1999 | John
Does anyone have an older DEK 260? I was wondering if a 1995 model 260 with DeKAlign 2 is capable of printing 12 mil fine pitch reliably. (Assuming that it is in good working order) Thanks for any input!!
Electronics Forum | Sat Aug 14 01:21:29 EDT 1999 | Dean
| | Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | | | TX | | Mark | | | I have used thetechni
Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A
It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu
Electronics Forum | Mon Jun 28 16:18:44 EDT 1999 | Earl Moon
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Mon Jun 28 17:03:59 EDT 1999 | M Cox
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Thu Jun 24 15:44:12 EDT 1999 | Earl Moon
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Fri May 28 19:43:32 EDT 1999 | Peter Wong
We are looking into frameless stencil systems for screen printing. Outside frame size of 29x29. Pros: smaller storage requirements and cheaper stencils. Cons: sharp metal edges, additional change over time required Can anyone relay their experien
Electronics Forum | Tue Apr 27 08:13:28 EDT 1999 | wayne sanita
i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks
