Electronics Forum | Tue Apr 25 18:51:06 EDT 2000 | Steve Thomas
We have quite a few stencils that either are debonding, have debonded, or we suspect will debond when we can least afford for it to happen. The epoxy is coming loose from the foil, but remains attached to the webbing. All the stencils that are comi
Electronics Forum | Fri Apr 14 11:00:38 EDT 2000 | Dave F
Mario: Your ask a very broad question and give no background information. Generally, the amount and type of residues present on a printed circuit board at the very beginning of a SMT line depends on the exposure of the board up to that point. For
Electronics Forum | Thu Apr 13 11:38:53 EDT 2000 | Kevin Facinelli
Couple more questions: The problem we have is that on the bottom side we are using a bunch of resistor networks. These have been very difficult to solder through the wave. The products: Top Side: 4-6 BGA 2/3 QFP 500 component
Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire
I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Sat Mar 18 07:22:37 EST 2000 | davef
Cartman: Ah, another "hidden cost" of no-clean. I love no-clean people they're putting themselves out-of-business and they don't even realize it, but at least they're saving money. Enough pontificating, "yes" to all of the above. 1 Yes, no-cleans
Electronics Forum | Wed Feb 23 20:25:17 EST 2000 | Chris Wallace
Like all who post messages here, I'm looking for a little bit (well, maybe a lot of bit) of help. We're currently going through a redesign of a board which will utilize several FPGAs. The manufacturer (Xilinx) recommends using solder mask defined p
Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean
Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
