Electronics Forum: problem (Page 271 of 1311)

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist

Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different

Low Silver Solder Problems

Electronics Forum | Mon Aug 24 13:12:28 EDT 2009 | ghepo

OK Eric, maybe you're right. My suggestion is to proceed by exclusion. First perform the tape test. Is easy and without costs. You have used many similar PCB without problem, but from the same vendor ? Is my experience that in similar cases the qua

Low Silver Solder Problems

Electronics Forum | Wed Aug 26 05:24:42 EDT 2009 | ghepo

Ok Eric, finally we know that the problem should be the PILLOW (sincerely, your photo is not very clear) and not the crack of the joint. There is a big difference on the failure mode of the two defects... If the problem is realy a pillow I only ca

ionic residues on the surface of printed circuit assemblies

Electronics Forum | Wed Sep 02 02:45:01 EDT 2009 | rocko

Hi All, Let me summarize the key facts and findings: 1) This is not a permanent problem. Only one production batch was affected. The cleaning solution was exchanged and now the cleaning process runs normally. 2) Probably the residues are not ion

Selective Solder Equipment

Electronics Forum | Tue Mar 23 15:46:28 EDT 2010 | pilusa

The AIM flux is for the process and not for the tip tinning. The flux I was referring to is what is used to keep the tip wetted which was one of your original problems. Regarding the process, in my experience the AIM flux is not very active and there

Radial capacitor placement

Electronics Forum | Fri Jun 18 15:37:44 EDT 2010 | remullis

One thing I have run into when placing cap's flush to the board is blow holes due to the plastic sheathing used around the cap. It would form a gasket going through wave and exhaust out of the holes therefore blowing the solder out with it. This cap

Dewetting

Electronics Forum | Wed Jul 07 11:02:07 EDT 2010 | davef

Rob gave you very good analysis and suggestions for troubleshooting your non-wetting issue. We agree with his sequence of troubleshooting. The following comments are meant to be a line to supplement Rob's plan of attack. This adds to Rob's comment

Crystalization on TI QFP and other fine pitch components

Electronics Forum | Thu Oct 28 11:50:11 EDT 2010 | phase1

We are having a little trouble with what appears to be a crystalization between our fine pitch parts. The problem appears after a a thourough wash of the pcb when dry. It looks like lead wiskers/haze between the joints.We are using water soluable lea

Using Vapour Phase Soldering Process

Electronics Forum | Mon Dec 20 22:41:42 EST 2010 | grantp

Hi, We had it for a while, but had to take it out and replace it with normal convection. I mean the soldering quality is absolutely amazing, and the joints looked perfect, however it was a horror for tomb-stoning. We tried all types of stencil apert

Wave Solder

Electronics Forum | Wed Apr 20 14:32:34 EDT 2011 | cbeneat

Hi all, A quick question to see if anyone can solve my issue. We are having problems with a particular board we run through our wave solder on a pallet. The board is populated with about 20 fuse clips, and one clip on almost every board gets fille


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