Electronics Forum | Mon Nov 15 20:26:33 EST 1999 | Clifford Peaslee
Hello SMTneters, The move is complete. The numerical IP address is temporary, until Internic changes the name pointer which should be in a day or two. Web email should not be affected. If you find any problems, please email me. Thanks, Cliff
Electronics Forum | Thu Nov 11 19:07:39 EST 1999 | Gary Kemp
We are having a continuing problem with 0603 chip capacitors not centering themselves on the pads during the reflow process, causing an open condition at one end. Does anyone know what can be done to alleviate this? Thanks much. Gary
Electronics Forum | Tue Jun 20 02:51:52 EDT 2000 | Leland Woodall
Gary, We've experienced the same problem in the past, and found that moving the stencil apertures closer together solved the dilemma. This was a much easier solution than having to redesign the PWB. Leland
Electronics Forum | Fri Nov 05 08:13:57 EST 1999 | Stefan Witte
I would blame the line computer software. You may have a job in there which wasn't properly closed. Although I haven't experienced problems like yours, I've heard about other weird placements due to line computer's "overload".
Electronics Forum | Mon Nov 01 10:16:42 EST 1999 | Mark Anderson
I am interested in getting some feedback on what different companies are doing to eliminate the solder beading issues on 0603, 0402 chip components using a no-clean process. We are currently incorporating a solder mask removal between the solder lan
Electronics Forum | Tue Nov 02 11:16:45 EST 1999 | Dave F
Pat: No, but if you describe the situation we may be able to sort through your soldering problem. Good luck. Dave F
Electronics Forum | Fri Oct 29 10:44:35 EDT 1999 | Doug Nebel
We have placed them before. You can only inspect the perimeter, but with the larger pitch in wasn't a problem. We also picked off matrix trays, but the BGA's we did had no center array. But if that type are on T&R it should work as well.
Electronics Forum | Sun Oct 31 19:36:19 EST 1999 | JC Leigh
Can you please give me a pointer on where to find the component package orientation standard in the IPC? I think we'll work up a spec sheet for the folks in purchasing and let them handle the vendor side of this problem. Thanks for your help! JC
Electronics Forum | Tue Oct 26 12:18:53 EDT 1999 | Gary Kemp
We are having a discolorization problem with the gold fingers on our PCB's. I have been made aware that there is a gold touch-up paint (masking) that is available. Would anyone know where I can get my hands on some of it? Any help would be appreci
Electronics Forum | Mon Oct 25 14:48:29 EDT 1999 | William
All, I am having a problem with joints being soft after SMT. Especially 25 mil and smaller parts. It seems as though you can slide the leads right off of the solder. It takes only about 30-40 oz. of compression at 45 deg. to move leads off of join
