Electronics Forum | Fri Sep 09 10:43:58 EDT 2005 | ???
sounds like the part is being picked up on its side....which means.......it could be.... 1. pickup not taught correctly -- X-Y- or Z 2. head to camera calibration is needed 3. or least likely....feeder problems
Electronics Forum | Mon Sep 12 14:08:33 EDT 2005 | Amol
The fluxes used in the board manufacture are RMA fluxes. The board is cleaned according to the IPC standards and tested to ensure quality. I am thinking of designing a DOE to isolate the problem
Electronics Forum | Mon Sep 26 15:12:38 EDT 2005 | Amol
hi, sorry for the late reply. We solved the problem by rinsing the boards in deionized water after alcohol scrub
Electronics Forum | Fri Sep 16 08:36:45 EDT 2005 | ajay
check some relay might be bad on MTU. we faced similar problem in IP3.
Electronics Forum | Fri Sep 30 08:30:23 EDT 2005 | CLampron
http://www.filtranmicro.com/plating.html This might help define what to look for for problems. Hope this helps Chris
Electronics Forum | Tue Sep 20 10:33:19 EDT 2005 | PWH
Lead-free??? You might see these kinds of problems with capillary action in t-hole items more-so than lead.
Electronics Forum | Tue Sep 27 23:02:55 EDT 2005 | selva Govind
Hi Mark, This problem can be overcome by adjusting the camera brightness - Gain & Offset. I think the offset value is very high. Try reducing it.
Electronics Forum | Tue Sep 20 15:43:27 EDT 2005 | fastek
You're having the same error/problem on three seperate machines? Are you sure they are properly hooked up?
Electronics Forum | Fri Sep 23 10:34:22 EDT 2005 | Rob
Thanks Base, Yes, we did use the overlap method but we still have problems. Thankfully that product is now obsolete, so until next time.... Cheers, Rob.
Electronics Forum | Tue Sep 20 17:39:52 EDT 2005 | russ
If the balls are eutectic (63/37) You shouldn't have any problems. All of our BGA rework is performed without paste. You have plenty of solder to make the joint with the balls themselves. Be wary of cleaning however since the standoff is less.
