Electronics Forum | Tue Jan 26 18:23:33 EST 2010 | glennster
I agree that Dage makes some excellent 3D (CAT) systems, but in our experience a high-resolution 2D system with tilt capability is usually better-suited for inspection of solder joints. Glenn Robertson Process Sciences
Electronics Forum | Thu Feb 11 15:50:33 EST 2010 | glennster
Sergey, For a component OEM lab I agree that X-ray is probably the first priority, especially for process development and monitoring. Be sure to get a system with sample tilt and high resolution capability. When SAM is needed, a service provide
Electronics Forum | Fri Nov 30 05:28:12 EST 2012 | d0min0
Hello, we are starting with the flex pcb production, can anyone advice a company in europe that is capable of design and manufacture palett / carriers / frames that allow to produce flex boards in standard smt process regards
Electronics Forum | Thu Jan 30 04:35:18 EST 2014 | aflex
HLC offers a new dimension for testing capabilities. HLC comprises software for data acquisition, test control, archiving and report generation functions which make the process fast, efficient and trusted. The performance of HLC software is heavily
Electronics Forum | Wed Jul 06 09:18:19 EDT 2016 | pavel_murtishev
Hi Dave, Thank you for the input. We have completely checked the whole process and solder mask thickness is the only thing that might impact. I wonder whether you might know chemical solutions capable to dissolve solder mask? Regards, Pavel
Electronics Forum | Fri Jul 31 19:14:58 EDT 2020 | emeto
Interesting one. I your machine placement algorithm capable to catch missing ball on the BGA while placing? Second question will be about component itself - datasheet will probably help. BGA body amterial? BGA balls alloy? BGA pad material before bal
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine
Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w
Electronics Forum | Wed Mar 10 17:03:52 EST 1999 | Morziana Hasan
NASA CommQuest Photopolymerized Conducting Polymers Directions: 1.Please read the information provided on this technology. You may follow the links to additional information resources below. 2.After evaluating the technology, please answer the
Electronics Forum | Tue Jun 16 12:39:25 EDT 1998 | Nancy J Dawdy
| As an equipment vendor (Panasonic Create group)I am extremely interested in GEM/SECS. It is really a nebulous concept. Everyone I talk to wants something different but it's all lumped under GEM/SECS! I ask a simple question. What do you want it t
