Electronics Forum: process capability (Page 41 of 72)

what software is out there that will extract XY centroid from gerber data?

Electronics Forum | Wed Jan 22 10:35:38 EST 2014 | unisoft

_a class=roll > href="http://www.graphicode.com/GC-PowerPlace" > target="_blank"_http://www.graphicode.com/GC-Power > Place _/a_this does, I had a dabble and while it > does seem quite capable the learning curve is > quite steep and I'd wager th

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean

Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou

Re: Cure/Reflow Profile

Electronics Forum | Wed Feb 23 04:47:29 EST 2000 | Dean

Hey Sal. Requests I typically receive from management stay just that - requests! Maby its just me but unless you have a single line capable of full double sided capability (printer, P&P, flipper (inverter), printer, P&P, reflow oven) the extra trou

Re: Polyimide PCB card assembly

Electronics Forum | Wed Jun 02 09:50:00 EDT 1999 | Earl Moon

| Hello all | I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with

BGA repair/rework

Electronics Forum | Sat Mar 06 10:25:55 EST 1999 | Earl Moon

I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. Concerning the BGA stuff, I'm getting about 60% success using this rewo

Re: Help-Wire Bonding Defects Analysis After Encapsulation

Electronics Forum | Thu Dec 03 13:39:52 EST 1998 | Russ M

| | | | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure

Placement Accuracy

Electronics Forum | Tue Mar 04 11:47:58 EST 2003 | msivigny

Hello John, Your second statement is a little vague about the 16th card shutting down the line with the 2x240 QFPs misplaced... i'll try to interpret, assuming the cards are actual product, which I think they are, your 16th card failed because 2 out

AOI, Pre or Post Reflow?

Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc

Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for

HighMixLowVolume P&P Equipment selection

Electronics Forum | Wed Jan 28 09:46:27 EST 2004 | stefwitt

I don�t know, what you are going to do with this type of request. Are you indeed making up your mind because a few readers give their hands up or down? All the machines listed above do a good job. However, consider that you will be married for a long

Yestech F1 AOI?

Electronics Forum | Fri Oct 20 08:31:18 EDT 2023 | laurence11

When comparing F1 AOI machines, the key differences lie in their specific models and features. The "YTV" you mentioned may refer to a specific F1 model, but without more information, I can't provide specific details on it. However, here are


process capability searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Reflow Soldering 101 Training Course
Solder Paste Dispensing

Software for SMT placement & AOI - Free Download.
best pcb reflow oven

Training online, at your facility, or at one of our worldwide training centers"
Win Source Online Electronic parts

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

Low-cost, self-paced, online training on electronics manufacturing fundamentals