Electronics Forum | Tue Jan 02 18:04:18 EST 2007 | russ
way too low of yield. with that technology on the board I would expect about 98% as well. So what are the defects? and more importantly, is your design, machine(s) and/or process(s) capable of this technology? Details I am sure are forthcoming R
Electronics Forum | Mon Oct 06 12:37:18 EDT 2003 | ramanandkini
It was a nice discussion. What I did here was a thermal shock test 1 hour@ +90 deg.c and immediately 1 hour @ -40 deg.c. The second test I did was a high humudity test for a week. After each test, I carried out a peel test with scotch tape. Those bo
Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
Electronics Forum | Tue Jan 30 17:36:59 EST 2001 | slthomas
Looking for recommendations for references on quality an process control.....SPC, process capability (cp, cpk), etc. My feet are a little wet on this stuff, but we'll be implementing soon so I'll need a reference to bail me out on occasion. You kn
Electronics Forum | Wed Aug 20 18:17:56 EDT 2003 | stefwitt
I guess we should differentiate between machine calibration, process reliability measurements and process capability study. For the machine calibration you use the machines own optical cameras, but for cpk or standard deviation you measure the place
Electronics Forum | Tue Sep 26 20:14:29 EDT 2000 | Dave F
I agree with Wolfgang that a check list, like he proposes, is very useful in evaluating your ability to assemble products. No sense designing a 16 inch board if the throat of your wave is 15 inches. Taking a different tact � what if you define your
Electronics Forum | Tue Sep 26 20:16:07 EDT 2000 | Dave F
I agree with Wolfgang that a check list, like he proposes, is very useful in evaluating your ability to assemble products. No sense designing a 16 inch board if the throat of your wave is 15 inches. Taking a different tact � what if you define your
Electronics Forum | Fri Feb 11 05:32:31 EST 2000 | Dean
Your customers design and your process capability would determin this (W/S vs. noclean). EX. Can you clean adequately for low stand off components? I have some BGA products which operate at 20GHz (atenuation and cross-talk is off the charts. )No wa
Electronics Forum | Tue Dec 21 16:47:15 EST 1999 | GERARDIN
Hello Pascal As mentioned by Wolfgang the key issue is the printing process capability. For a thick copper level 90�m we noticed that the pad reduction can be greater than 20% depending on supplier sources. Typicaly for a cad Width = 0.4 we can
Electronics Forum | Wed Mar 18 13:25:55 EST 1998 | Earl Moon
| Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | Mike Yes and often. People
