Electronics Forum: process (Page 1061 of 1146)

Where's the rush?

Electronics Forum | Fri Feb 24 13:04:17 EST 2006 | patrickbruneel

Hi All, The change over to lead-free is as easy or as difficult as you want to make it The big problem I see with this lead-free transition is that there is no benchmark of acceptability and no defect data (yet) related to visual appearance of a sol

Question on Thermal Overstress on BGA Balls During Rework

Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier

We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th

Air inclusion in solder paste

Electronics Forum | Sun Mar 26 19:02:05 EST 2006 | ms

Hi We are running automatic stencil printers, open squeegees, stainless stencil, stainless blades, print speed 25-30mm/sec. We have a frustrating consistency issue printing .37x.3mm apertures on a 45pin LGA (11 pads each side, 1 large ground in mid

Double Sided Reflow - Low Melting Point Solders

Electronics Forum | Mon Apr 03 01:35:31 EDT 2006 | darby

I have a less than perfectly designed pcb requiring double sided lead free reflow. Several components from either side will detatch using the standard process. If I was using Sn63Pb37 I would just dispense some adhesive after paste and cure at the r

AIM SN100C Solder paste

Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad

I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch

LASER SOLDERING

Electronics Forum | Tue Apr 11 12:40:47 EDT 2006 | Chunks

Depending on model and/or series, each one has it's own specific manufacturing guidelines you must meet in order to get a successful solder joint. Then you must couple that to what your soldering process is. Assuming you are talking all thru-hole,

Masking of PWBs prior to conformal coat

Electronics Forum | Wed Apr 19 11:50:05 EDT 2006 | amol_kane

Hi BJ, Everyone's favourite answer...it depends! If the volume if large, masking boots will save you both, time and money in the long run. Custom boots are relatively expensive to buy, but they pay themselves over time by savings on masking tape. ma

Tip life of soldering irons with lead-free (SAC305)

Electronics Forum | Fri May 12 07:53:40 EDT 2006 | egrice1

Sheldon, Tip life is directly related to temperature, IRON plating thickness on the tip, Alloy composition used and operator technique. High tin contents in lead free alloys attach the tips. Poor wetting and higher melting temperatures cause us

Water Soluble vs. No Clean

Electronics Forum | Tue May 02 18:15:21 EDT 2006 | Mike Konrad

We manufacturer cleaning equipment (full disclosure) so, our answer may seem self-serving. The facts however are accurate and relevant so here I go� Changing from an OA (water soluble) flux to a no-clean flux makes sense. After all, even die-hard

Is anyone using K100 bar solder? Why or why not?

Electronics Forum | Thu May 11 08:27:15 EDT 2006 | timnop

We will be receiving our lead free wave solder machine soon and I have been doing a lot of reading here. I've seen many dicussions about SAC vs. SN100C for wave applications and am leaning heavily towards the SN100C for my process. I haven't seen any


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