Electronics Forum | Tue Oct 24 17:01:15 EDT 2006 | grizzy
Well super, super, sorry I had cap locks on - no yelling intended. Let's keep this a technical forum. Many manufacturers charge to register their equipment prior to selling parts or providing service. Agree or dis-agree with this practice it is a re
Electronics Forum | Wed Nov 08 08:59:54 EST 2006 | Amol Kane
well, if in the past you havent seen this issue, then something in the process has changed......as any good process engineer should do, investigate it.....new batch of paste?, expired paste?, clogged stencil?, change in programming parameters?, chang
Electronics Forum | Sun Nov 19 22:21:37 EST 2006 | KEN
When you say "SMD" I am assuming you are refering to a component. But in your description you mention these are some type of "boards". "flatness" or coplanarity is a function of the application and process. I think in your case your standards wo
Electronics Forum | Wed Nov 29 01:25:53 EST 2006 | callckq
Dear All, I have 1 product that using solder bar from vendor called Asahi. After wave process, we found quite a sticky flux residue remain on the board. Eventually, have huge impact on our ICT fisrt pass yield(FPY). Current FPY is a the range of
Electronics Forum | Tue Dec 26 10:54:37 EST 2006 | yusufgomec
We use hot air leveling (HAL) process in pcb production. HAL process is 3 steps. �n 1. step flux. 2. step is HAL. And 3. step is rinsing. As you know there is mustn't any flux after rinsing operation. Our flux chemical is water soluable. But there ar
Electronics Forum | Mon Jan 22 11:50:07 EST 2007 | BWET
Can anyone recommend a material which can be used an a bare board: 1. Dispensed via a syringe 2. Mimmic the electrical characteristics of a trace 3. Be processed such that they do not reflow with the solder interconnect 4. Be processed such that the
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Mon Jan 29 10:41:30 EST 2007 | aj
Rob, We have ran LF BGA's with Lead Paste in the past. We actually got a MicroSection Analysis carried out and a full report which approved the Process. We had peak Temp around 225oC- 230oC . Its a matter of running the Lead Process at its max and
Electronics Forum | Sun Feb 11 23:32:43 EST 2007 | M.Haris
1. After reflow some boards start producing bumps/bubbles which damage the internal layers causeing PCBs failed in Electrical-testing. How can I eradicate this problem from my assembling process? 2. If SMT components are mounted on non-rigid FLEX PC
Electronics Forum | Wed Feb 21 08:33:37 EST 2007 | CL
Good Morning Everyone, I just wanted to get a feel for what other Contract Mnufacturers are doing. Do you allow a production PCB assembly with glued SMT components to be wave processed more than once? (e.g. the first pass did not produce acceptable
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