Electronics Forum: process (Page 461 of 1148)

Reflow Profiling

Electronics Forum | Mon Jul 24 02:01:22 EDT 2017 | tsvetan

This will depend on many factors: your reflow oven chamber size, your oven temperature controller, the speed of the conveyor, size and mass of your PCB, etc etc. In practice you should adjust the profile for each case if you want to set in the optim

Tombstone components issue after reflow?

Electronics Forum | Sun Aug 13 22:26:01 EDT 2017 | dawson

Anyone who knows how to prevent such > flaw? > > Tombstones are those lifted components > from one sides. This results in costly and > time-consuming amounts of touch-up and re-work > after the assembly is completed. For the > customers, this e

Ionic Contamination Testing

Electronics Forum | Tue Nov 07 00:33:40 EST 2017 | aqueous

If no-clean flux is reflowed correctly, many of the activators are encapsulated within the resin residue left behind after reflow. An ionic contamination test cannot differentiate between ionic residue that was encapsulated (not harmful) and residues

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval

Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe

Electrical Test problem

Electronics Forum | Thu Jan 18 17:26:30 EST 2018 | davef

I'm aware of no electrical test for detecting voids and air bubbles. If someone was x-raying my boards and saw voids and air bubbles and they weren't happy about it, first thing I'd do is convince them that the boards a within standard. You know some

MIRAE 1030P

Electronics Forum | Fri May 11 16:05:27 EDT 2018 | aj

questions I asked: “It seems the vision system is not reliable. However, we need to get the procedure to create and debug fine pitch parts such as BGAs anf QFN’s to understand how the machine operates.: Common errors: • Even after doing the vision t

How to generate correct silkscreen from Eagle

Electronics Forum | Wed Aug 01 18:36:15 EDT 2018 | totalmedtech

Open->Job, you can select either 'Gerber' or 'Gerber274x' If you create the layer yourself you just need to press 'Add' in the bottom right of the screen and give it a name that means something to you, and the correct extension (I assume you know thi

SMTnet Site: Need Your Input

Electronics Forum | Thu Aug 02 21:22:15 EDT 2018 | davef

I need your input. What are your thoughts? Currently SMTnet is looking to improve process. It uses four different lists of categories that all are maintained and updated separately. A single LIST makes sense. Approaches to arranging the LIST being

Bubbles after coating

Electronics Forum | Fri Sep 21 17:33:01 EDT 2018 | michaelszuch

Hello Hai, The first step is to determine where in the process the bubbles are being generated - either during coating or during curing. You can easily check this by letting a few boards air dry (no oven) and comparing them to the oven-cured ones. I

PCBA Time Estimation Formula

Electronics Forum | Wed Feb 19 12:47:15 EST 2020 | emeto

Grandpa, You got it - Identifying the bottleneck operation is the key. The secret is to design a tool can predict accurately where this bottleneck is. In your formula you can use machine process time, PCB transportation time, part trim time, part in


process searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

High Throughput Reflow Oven
See Your 2024 IPC Certification Training Schedule for Eptac

World's Best Reflow Oven Customizable for Unique Applications
SMTAI 2024 - SMTA International

High Precision Fluid Dispensers
Void Free Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"