Electronics Forum | Tue Aug 18 06:56:02 EDT 1998 | Wayne Bracy
| Does anyone have any recommendations for SMT Adhesive and Solder Paste Cleaning Systems? We are looking for a complete system of Chemical, Equipment, etc... Val: You may want to take a look at Austin American Technologies. AAT has several syste
Electronics Forum | Thu Aug 06 12:58:35 EDT 1998 | Paul J. Lingane
Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not elect
Electronics Forum | Mon Aug 10 21:52:34 EDT 1998 | Dave F
| | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not
Electronics Forum | Sun Aug 02 12:24:23 EDT 1998 | Bob Willis
Sorry all the parts I have processed are just like standard BGA just swing back into possition unless they are placed off the pads and touching the next pads. All my parts have had heat sinks and are the same weight as PBGA. Are your parts light. If
Electronics Forum | Wed Jul 29 22:50:17 EDT 1998 | Dave F
| We are investigating alternatives to HASL finishes for more dense PWBs. OSP is not a good choice because of low solid flux and possibly long shelf life. Immersion gold is expensive and so far has been more difficult to wave solder. Has anyone ha
Electronics Forum | Wed Jul 29 04:03:15 EDT 1998 | Bob Willis
The Reflow Soldering Interactive Test was well received in the industry with over 200 engineers testing their process knowledge. Now its time to take the Wave Soldering challenge and test you knowledge on soldering through hole and surface mount. Bot
Electronics Forum | Tue Jul 28 07:07:00 EDT 1998 | John Godfrey
I need to remove all flux splatters from our boards. We've adjusted the oven profiles with the production paste, but have not been able to eliminate the splatter. I've tested sample from several paste suppliers and have only been able to find 1 which
Electronics Forum | Sun Jul 26 20:56:43 EDT 1998 | Masdi Muhammad
We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the goldfinger during touch-up or rework and to reduce the contamination we are planning to implement 'tapin
Electronics Forum | Wed Jul 22 10:26:46 EDT 1998 | Bob Yost
My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board.
Electronics Forum | Thu Jul 23 07:03:09 EDT 1998 | Wayne
| My firm has just begun it's first PCB that will use BGA packaging. I have been reading up on the processes involved with BGAs and was wondering if you need to apply solder paste to the pads prior to applying heat and mounting the part to the board
