Electronics Forum: process (Page 801 of 1147)

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 15:04:11 EST 1998 | Todd N

| We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | 1) Do you need

Re: Any help reflow soldering Through Hole parts

Electronics Forum | Fri Mar 06 23:02:43 EST 1998 | Scott McKee

| | We have a double sided pcb that is surface mount on both sides. Now a Through Hole connector has been added. Appart from hand soldering does anyone have info. on reflow soldering the part. The connector is 0.1mm pitch, square legs. | | 1) Do you

Re: Solutions For Low Volume BGA/SMT Rework

Electronics Forum | Thu Feb 19 13:52:58 EST 1998 | mike c

| We are in need of a low cost system for the rework of | various SMT devices. Ideally the machine should support BGA, | SQFP, and large PLCCs. | Is it a dream to ask for SMT tweezers, a regular iron, | and a convection pencil as well? Want a machin

Re: STATISTICAL PROCESS CONTROL. 6-SIGMA

Electronics Forum | Wed Jan 14 08:24:07 EST 1998 | Allison

Good luck in your conquest. I have been struggling with the same issues for some time now. I have made the following conclusions. First, it is nearly impossible to establish parameters in SMT to perform X-Bar and R charts. Electronics is not as cl

Re: Vapour Phase Soldering

Electronics Forum | Thu Dec 11 09:57:38 EST 1997 | Alan Brewin

Thanks to Scott for your reply, much appreciated. Are you aware of any new developments in this area? Particularly in respect to the solvents? We are aware that fluorine chemistry is now in-use with amazingly high boiling points. We understand that

DFM checklist

Electronics Forum | Wed Aug 08 21:24:52 EDT 2001 | davef

First, not that it�s bad, but SM-782, the land pattern standard is a pretty far distance from a DFM check list. Now, if you�d said D-275 er more properly 222X, ama be twitchin� less. Second, your process should include two distinct elements: 1 Data

Wave Soldering Ceramic PCB's

Electronics Forum | Thu Aug 09 16:41:12 EDT 2001 | johnw

Dave , you know it's your cheery disposoition I love.... Ok so the process: Process is Double sided reflow for SMT & PTH via the wave. Like I said or did I, I forget and can't check back...it's a spray fluxer with noclean mutlicore NR3s-06 water b

Glue Dispense Process Control

Electronics Forum | Fri Aug 10 13:28:19 EDT 2001 | Hussman

Hey John, You're not alone, a lot of people have the same problem with different machines and material. What is your specific problem, just keeping SPC control? Or are your defects at the wave from the glue too? If it's a process problem, I found

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve

To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de

DPMO calc and Overall Manufacturing Index (OMI) calculations

Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker

To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component


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