Electronics Forum | Mon Dec 06 08:55:11 EST 1999 | Dave F
Vinesh: The white residue is perfectly expected, when washing a no-clean with water (and some alcohol). In some cases, the white resin that you are seeing can be removed. Your paste supplier should be able to provide details. Recognize that clean
Electronics Forum | Tue Dec 07 08:11:04 EST 1999 | Wolfgang Busko
Hi Russ, there�s something I don�t understand about the measures you took. I guess that TAL means time above liquidous and shortening of that time can result in bad dissolution of the protective Au-layer. The necessary time for the Au to mix with you
Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F
Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process
Electronics Forum | Thu Dec 02 11:28:03 EST 1999 | Mark D. Milward
Dave F. Thanks for the info. I've spoken with Ralph and Les Hymes in the past and have taken Manko seminars before. I read something not long ago that Dr. Juran had written on the subject of Zero-defect soldering programs and was hoping for response
Electronics Forum | Thu Nov 18 19:45:26 EST 1999 | Deon Nungaray
Deon Response: Hello Will, Yes, you can reflow a double sided board using 63/37 solder paste on both sides. There are some limitations as far as the mass of the components to reflow the second time. If you have doubts or are concerned that a compone
Electronics Forum | Sun Nov 14 20:52:38 EST 1999 | chartrain
What is your definition of a lot of money for a UPS? You mention very expensive components on your boards. What is their worth comapred to the UPS? A generator hooked to the conveyor would in theory work. but what is the cost of the generator? Who wi
Electronics Forum | Fri Nov 12 13:05:36 EST 1999 | Brian W.
As a CM, I have had customers stack components as a temporary measure of incorporating an ECO. Most of the time, it includes using an adhesive to secure the component. Cost of material already in-house is the major factor when this occurs. Even th
Electronics Forum | Fri Nov 12 05:14:42 EST 1999 | S L CHANG
We are currently cleaning solder paste (TAMURA SQ-1030FP) from stencil using an ultrasonic stencil cleaner with solvent (HYSPER-Non CFC). The process cycle time is 30 sec. cleaning in 1st ultrasonic tank and another 30sec. cleaning in 2nd ultrasonic
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Tue Nov 09 23:52:31 EST 1999 | chartrain
Could very well be your nitrogen diffusers are blocked. These have to be cleaned on a regular basis as well.Cleaning frequency for the diffusers is flux dependent as well as other factors but could be as little as one month of operation. Once the dif
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