Electronics Forum | Sun Nov 25 22:54:20 EST 2001 | ianchan
Hi All, We juz purchased a 2nd hand CyberOptics 3D paste inspection machine (what a mouthful...) and am seeking info : 1) what formulae is applicable, to calculate the deposited solder paste volume onto the pre-defined PCB pads? 1.a) from our obse
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Thu Dec 06 19:46:08 EST 2001 | davef
First, we�re assuming that we�re talking hot air solder leveled [HASL] bare boards, eh? Consider using A-600 - Acceptability of Printed Boards as the basis for discussing the bare board problems. It is the bare board analog of A-610 - Acceptability
Electronics Forum | Fri Dec 07 10:56:24 EST 2001 | franciscoioc
HI, I exeperience this problem before and I tried diferent type of solder pastes.The one that help my process is a Kester solder R596L OA this is a water soluble paste that i am very sure is going to help you.You can get the technical data at http:/
Electronics Forum | Wed Dec 19 02:24:40 EST 2001 | ianchan
Did I mention, we tried to use the same WS flux formulae to brush-cover the affected flex-PCB pads, and subject it to another round of water-wash, followed by oven-baking, and it still doesn't help abit? Oven bake : 100 deg-C, approx 15~30mins (manu
Electronics Forum | Mon Dec 31 08:51:58 EST 2001 | davef
Warp depends on: * How close the board gets to its Tg during the solder cycle (the closer you get to the Tg the worse the warp gets) * Amount of copper on each side and the balance between the two * Thickness of the board * Overall length x width * T
Electronics Forum | Thu Jan 03 08:02:53 EST 2002 | davef
Slump is a function of the particular paste you select and the temperature of the paste. Use a slump test like the one that follows to compare fluxes. Slump Test Step Process activity 1 Print paste on white ceramic substrate or microscope sli
Electronics Forum | Mon Jan 07 21:07:00 EST 2002 | davef
Using a flux pen sounds like a good idea. Comments are: * I assume you�re talking aqueous flux. If not, some NC flux pens leave white residues. Nearly all of 15 samples suffered to varying degrees with white residues. * Use the same flux that you
Electronics Forum | Wed Jan 09 11:14:39 EST 2002 | stefwitt
I wished, I would get a job like that. Malta is a nice spot! With 1500 Cph you can select any machine on the market, but here are some questions. If you use a glue machine you apparently deal with mixed technology boards. If your volume is that low,
Electronics Forum | Mon Jan 14 15:15:25 EST 2002 | burb1999
Currently our company is in the process of putting together a SMT prototype line... I have experience with fuji, universal, DEK, MPM, BTU, Electrovet in a high volume application. Now with prototype builds we have narrowed down a few and would like
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