Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp
Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist
Electronics Forum | Wed Feb 25 22:32:39 EST 2009 | exsydeco
the company name is similar to my screen name. you will be smart enough to notice it, it is in forli, italy. machines that i service is Yamaha/Philips. He sells feeders too, but junk feeders that he take for free (thats what he said) from customers
Electronics Forum | Fri Mar 06 10:50:21 EST 2009 | fountain42
Just my opinion but it look's like your doing a great job. i would try another paste. I'm somewhat lucky that we get to use OA's. If your stuck using the no-cleans they are so tempermental. (The nitrogen is making up for the poor paste) Your de-wetti
Electronics Forum | Mon Mar 09 13:07:52 EDT 2009 | rodrigo
Hi all, Our IP-2 stop working during production with a Servo NG error. Turning it on and off just goes back to the same thing or "Turn servo power on" error message. I was checking the power for the servo amps and I found a 35VAC line that is missin
Electronics Forum | Wed Apr 29 17:43:14 EDT 2009 | smt_guy
I have a Product with 2 Different PCB Fiducial allocation in the Design. It has 4 Fine Pitch components. The first PCB DO NOT have Fiducial Mark on the board itself BUT has Fiducial on the Break-OFF Tabs. The second PCB has no Break-Off Tab but has f
Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc
Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab
Electronics Forum | Tue Jun 02 02:52:24 EDT 2009 | jasreeves
Probably covering old ground here, but when I read marketing data, brochures etc for new P&P machines, they always state the CPH. You know... 12,000 chips per hour or 18,000 chips per hour and so on and so forth. However, you try and place 0201's at
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Wed May 27 18:19:58 EDT 2009 | dcell_1t
yesterday I tried with vision type 20, just defined the two pair of leads and error 1CA14003 came up, on flexa error help says the following: Cause: The Vision_type in part data is expressed using hexadecimal notation (??). If ?? equals 0A, 0B, 0C,
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