Electronics Forum: production (Page 676 of 873)

SN100C Selective Solder Voiding

Electronics Forum | Wed Nov 12 18:58:19 EST 2008 | joeherz

I attended SMTA's copper dissolution webinar this morning and am almost convinced that this is not our problem. Still planning to do cross sections to verify but our dwell times are nowhere near levels that could cause a problem assuming good platin

pick and place vaccum

Electronics Forum | Mon Nov 10 13:27:07 EST 2008 | evtimov

Hi janz, you should be aware of everything. You are going to change subsystem on your machine. How much vacuum you need on the machine? Can you control the vacuum level with your system? Can you control the the system at all? Is it really much more

WHat software do you guys use to convert files?

Electronics Forum | Fri Nov 14 10:38:17 EST 2008 | unisoft

You can use UniSoft ( http://www.unisoft-cim.com ) to solve your problem. They advertise here on SMTnet and are a 22-year-old software company. Their combination ProntoPLACE ( http://www.unisoft-cim.com/pcbplace.htm ) and ProntoGERBER-CONNECTION (

PBF BGA or PB BGA

Electronics Forum | Mon Dec 01 12:39:06 EST 2008 | tsvetan

this is really nice one ;) paper and cotton have lowest potential to generate static electricity see below, and usually is good practice to wear cotton glowe at least to one of your hands to not leave greasy finger spots on the gold finish of the PC

Siemens/Tecnomatix Assembly Expert 7.3.0 problem

Electronics Forum | Wed Dec 10 08:33:08 EST 2008 | lkpdsund

Hello! I have a problem with Assembly Expert 7.3.0. During optimization of the assembleon AX5 an error occurs; The program seems to have a problem connecting the machine library with the component library (device.lib). Even though I have defined th

Shielding from Nearby Heat-Any Tricks

Electronics Forum | Wed Dec 24 18:31:04 EST 2008 | hegemon

If they share a common ground plane you are in for some difficulty in trying to prevent the second part from heating too much. What happens to the underfill material when it is softened by being heated beyond the 160C? Does it harden up again, or b

Business Survey

Electronics Forum | Wed Jan 07 12:42:19 EST 2009 | dyoungquist

We are a small (18 employees) OEM company who also provides EMS to other local companies in our area. Q3-Q4 2008 we did see a small downturn in our OEM sales. Our EMS side actually stayed pretty flat over that same period. Like rob, we have a high

AOI - Algorithms or Comparators

Electronics Forum | Mon Feb 02 15:25:44 EST 2009 | fishingfool

muarty, Each has their place. Rules based systems (algorithm) are harder to program and I have seen post on here with people saying there is no real difference in defect detection. Image based systems are much easier and intutitive to program.

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp

Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp

Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist


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