Electronics Forum | Fri Mar 05 04:19:03 EST 2010 | aungthura
Ya, that could be happened bcoz of reflow profile.I think, in this case, each lead got the different temperature during the reflow process. If the solder had melted properly,the hot lead would have attracted the solder to cover itself.
Electronics Forum | Thu Mar 04 17:56:17 EST 2010 | rmitchell
Hi, When we load a recipe (oven profile) on our heller 1809 the pc screen goes black, the oven turns off then comes back on and the error is communications with oven was lost. Anyone seen this error before? rob
Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell
SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P
Electronics Forum | Sat Apr 17 04:15:19 EDT 2010 | grahamcooper22
As a solder paste supplier I have profiled lots of different makes of ovens. I really like the Heller 1707. I have several customers who do lead free mid volume assembly with these ovens. They also seem to give shiny lead free joints.
Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura
Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.
Electronics Forum | Mon Jul 12 05:01:30 EDT 2010 | cobar
Please follow the paste suppliers specs for the paste as an indicator.Most people think that if they follow the paste suppliers recommendations to the T it will be a perfect profile but this is not the case.Play around with preheat settings but follo
Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway
if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste
Electronics Forum | Mon Aug 09 13:02:47 EDT 2010 | Dennis O'Donnell
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Electronics Forum | Fri Aug 20 10:07:09 EDT 2010 | dan_ems
Hello, I have the same problem ..., please take a print screen with the profile to see how is made it. Thank !
Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70
Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause
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