Electronics Forum: profil (Page 171 of 463)

Solder cover

Electronics Forum | Fri Mar 05 04:19:03 EST 2010 | aungthura

Ya, that could be happened bcoz of reflow profile.I think, in this case, each lead got the different temperature during the reflow process. If the solder had melted properly,the hot lead would have attracted the solder to cover itself.

Heller Oven communication error

Electronics Forum | Thu Mar 04 17:56:17 EST 2010 | rmitchell

Hi, When we load a recipe (oven profile) on our heller 1809 the pc screen goes black, the oven turns off then comes back on and the error is communications with oven was lost. Anyone seen this error before? rob

SAC BGA in Pb Process

Electronics Forum | Mon Mar 29 16:33:29 EDT 2010 | mikesewell

SAC 305 liquidus is 219 C. A hybrid profile is often recommended with a peak of 230 C (reflow the SAC and not kill the Pb parts) with an extended liquidus of 60-90 sec to get good alloy diffusion. Or if the design (parts & pwb) can tolerate it go P

I need an Oven

Electronics Forum | Sat Apr 17 04:15:19 EDT 2010 | grahamcooper22

As a solder paste supplier I have profiled lots of different makes of ovens. I really like the Heller 1707. I have several customers who do lead free mid volume assembly with these ovens. They also seem to give shiny lead free joints.

sockets soldering

Electronics Forum | Sun May 16 20:47:25 EDT 2010 | aungthura

Thanks Dave I tried various sockts but all were failed.At SnPb profile,maximum- 230'c~240'c, the solder at sockets' pins not melted.Increasing to 250'C, the sockts were deformed.

preheat slope vs ramp up- what is different?

Electronics Forum | Mon Jul 12 05:01:30 EDT 2010 | cobar

Please follow the paste suppliers specs for the paste as an indicator.Most people think that if they follow the paste suppliers recommendations to the T it will be a perfect profile but this is not the case.Play around with preheat settings but follo

I want to learn about bga technology from a pick and place mache

Electronics Forum | Thu Jul 15 12:09:10 EDT 2010 | wrongway

if the BGA has leaded balls use leaded paste if the BGA has lead free balls use lead free paste and set your oven profile to match the paste

Looking for SMT Consultant in Bay Area

Electronics Forum | Mon Aug 09 13:02:47 EDT 2010 | Dennis O'Donnell

I'm available in the SF Bay Area. Check out my LinkedIn Profile to see my background and customer references here: http://www.linkedin.com/in/dennisodonnell Web site info here: http://www.pcb-repair.com/consulting_services.htm

Solder Balls-No Clean Paste

Electronics Forum | Fri Aug 20 10:07:09 EDT 2010 | dan_ems

Hello, I have the same problem ..., please take a print screen with the profile to see how is made it. Thank !

Voiding in LGA (LT) soldering

Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70

Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause


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