Electronics Forum | Fri Jan 07 10:27:50 EST 2011 | rpatel28364
We havn't done any failure analysis on this BGA. We have this information from customer. currently we dont have anything to check solderability for BGA. Only thing we rly is Profile on solder sample un populated board. Also we are building only 100 u
Electronics Forum | Wed Jan 26 17:36:22 EST 2011 | ck_the_flip
had a quick question regarding compatibility of Sn100C HASL finish and regular Sn63 solder paste. Does the thermal profile have to reach Sn100C eutectic temps. in order for the Sn 100C HASL to coaelesce with the Sn63 Solder paste? How reliable is t
Electronics Forum | Wed Feb 23 01:06:06 EST 2011 | kemasta
Hi all Recentlt I encounter a issue, the solder paste was not dry after wave. Mostly happen and the end of the board. It is rare case, 1 day happen about twice. But to achieve our quality target, I still need to overcome this issue. I use Alpha OM-
Electronics Forum | Mon May 02 17:16:02 EDT 2011 | pbiron
We have recently started up a vapor phase machine and no body can tell me what an ideal profile should look like. I preheat the board about 10 degrees lower than the melting point of the solder paste. The joints look great! Just have no documentation
Electronics Forum | Fri Jun 10 14:54:25 EDT 2011 | dimation55337
Greetings Everyone, We have lost our copy of the Soldapro Oracle for Multicore's Soldapro Thermal Profile System Model TPS 001. This is not the Slimline model. We have a Slimline, and it's software package (v2.9, dll v1.23) is not compatible with t
Electronics Forum | Mon Jun 13 09:25:58 EDT 2011 | milroy
Hi I have seen some of our multilayer PCBs are having delamination issues even after baking them in the ovens. Does anybody faced this issue before? The problem occured after reflow process and wave solder process as well. The temp profiles are well
Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
Electronics Forum | Fri Jul 08 04:09:59 EDT 2011 | leadthree
I hope to get some feedback here. I have a SMD connector that reflow-solders quite poorly (I guess solder paste or profile issue). On the X-ray I see strange bubbles, does it mean there are voids under pin? Generally I am not satisfied with the sol
Electronics Forum | Fri Jul 08 08:01:32 EDT 2011 | joekirin
Hello, I am having a problem with a large amount of solder balls surrounding mostly the legs of fine pitch ics. There seems to be a large collection in gap between the pad and the solder resist. They do not easily wash out. Our profile seems to be
Electronics Forum | Fri Jul 08 12:53:56 EDT 2011 | markhoch
I concur with Mr. KaHrpr and Mr. Dave. Just because your measured profile falls in the middle of a process window doesn’t mean that you won’t ever have to analyze it. You may be 9/10ths of the way there, but running 25 miles won't win you a marathon
