Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Fri Oct 06 15:12:17 EDT 2000 | Dave F
Alberto: Consider Dymax 911. It�s wave solderable and passes Cl ion, copper mirror, SIR, and electromigration tests. We have heard good things about Masterbond uV curables, but have not looked at them. 911 doesn�t cure very deep into the little d
Electronics Forum | Fri Sep 22 05:33:59 EDT 2000 | Wolfgang Busko
That "C - it doesn�t matter" choice sounds good because it doesn�t give you a headache when profiling but it gives me a headache when I read the article in the current "newsletter" about profiling where I found this: "If soldering to gold over nick
Electronics Forum | Tue Jul 11 13:21:30 EDT 2000 | Deborah Troxell
We use the Slimkic for our oven porfiles and run a very high product mix too. My first question is do you use the same progam for all your boards or do you run different temptures profiles for each module? How are the gold boards getting destroyed? W
Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler
We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build
Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
Electronics Forum | Thu Feb 24 16:08:54 EST 2000 | Gary
I have the situation where we may need to use a variety of reflow temperatures. It seems that the design engineers want us to try a variety of "unspecified" pastes on the products. For example, the first PCB would be assembled using a higher temperat
Electronics Forum | Sun Jun 10 11:31:27 EDT 2001 | nifhail
Everybody aware of the tomb-stone problem on 0402 package. I've done everything I could i.e. Profile, placement, 10 Deg placement, stencil design, but still this culprit exist. One things for sure is taht I have a very bad pad size for 0402 ( 25 mil
Electronics Forum | Mon Jun 11 14:25:36 EDT 2001 | CPI
I had the very same problem but, did not question my oven as I knew the profile was good and I should have had even heating. So I then looked at pad size and layout. When Layout and size were found to be ok. I attached a prob to each pad and ran a pr
