Electronics Forum | Wed Apr 19 02:31:02 EDT 2017 | robl
Hi Phil, We ask our PCB suppliers for solder samples and any drop out from manufacturing PCBs and use these for profiling, test process runs etc. If your purchasing team is approachable enough it is worth having the conversation. I would alway
Electronics Forum | Mon May 01 12:32:50 EDT 2017 | emeto
Looks like you have bad wetting. I will do in this order as it is easier to troubleshoot starting with the machine and transitioning to the PCB: 1. First clean some bare PCBs really good and try again. 2. Check thermal profile 3. Check flux - amount
Electronics Forum | Tue Aug 01 18:28:47 EDT 2017 | zsoden
Thanks for the suggestions. 1. By this are you referring to the flux specifications or the actual profile of the machine? 2. Yes, the entire machine, the solder pot and the wave nozzles have all been levelled. The better joints on one side are perp
Electronics Forum | Wed Jul 12 06:29:11 EDT 2017 | jamesbarnhart
Soldering electronic components like electrolytic capacitors can be some of the most difficult terms in PCB repair. Electrolytic capacitors, like other components, come in two main formats. 1. Through-hole capacitors have long leads designed to pass
Electronics Forum | Wed Aug 09 20:03:22 EDT 2017 | ttheis
We're having problems with Kester pastes (NP545 pb free and EP265 60/40 no clean pastes.) All of our other components reflow just fine with either paste, but for some reason this QFN chip doesn't wick to the QFN's pads well. It seems like some type
Electronics Forum | Mon Aug 14 03:25:51 EDT 2017 | spoiltforchoice
There is no solution in above case, this is > caused by the PCB design. There are no > thermals on the pads connected to the copper > poured area. So the other pad reflow first and > lift the component. Yes, this. You could try playing with
Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics
The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi
Electronics Forum | Sat Aug 12 11:55:52 EDT 2017 | sankarseptember
We are facing component Drop on second side of the reflow.We are using Senju Reflow oven..Profile judgement was within in the standard.All the component Drop occur in between last heating zone and cooling Zone.The dropped component is ICC 525FL5 SOP
Electronics Forum | Wed Feb 14 16:44:01 EST 2018 | cbart
Probably to late for ya, but: -Center support -mesh belt and conveyor (have the mesh is nice for 1st side runs to keep the board flat. -N2 capable, in case you need it -on board profiling -smema if needed -board drop detect (sensor at input and exit)
Electronics Forum | Thu Mar 08 07:24:40 EST 2018 | proceng1
That's what I said when we started talking about 48inch boards. Everything changes. New printer, bigger stencils, new pick & place. Different even profiling (the board is in 3 zones at the same time). Plus board racks don't work well. The old Boa
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