Electronics Forum | Wed Feb 11 16:38:20 EST 2015 | barryg
I was curious what others in pcb assembly are doing as far as profiling. Is profiling an important part of the smt process? Should every board type processed be profiled to determine optimum oven temps per paste recommendations.Is it ok to assume tha
Electronics Forum | Thu Feb 12 13:00:19 EST 2015 | emeto
You should definitely profile your new BGA containing PCB with a real profiler with attached thermocouples. I would actually drill a hole under the BGA and put a thermocouple there.BGAs usually require longer profiles with longer soaks zone.....and s
Electronics Forum | Thu Feb 12 12:22:04 EST 2015 | barryg
Thanks for your input Rob, Our operator does not profile pcb's which so far we have not had issues that could be attributed to his oven settings. We may be running a pcb with a BGA on it and I was concerned about our lack of profiling. I have spent q
Electronics Forum | Fri Feb 13 10:10:21 EST 2015 | rgduval
I'm with Evtimov...if you've got a new assembly with a BGA (and especially if BGAs aren't an every day occurrence in your process) it should definitely be profiled. I have run BGA boards without profiling before, and got lucky...but, I wouldn't reco
Electronics Forum | Thu Feb 12 10:06:00 EST 2015 | rgduval
Funny, I just had this discussion on LinkedIn. Must be the season. It is always acceptable and preferably to profile every assembly, if you have the time, resources, and equipment to do it. That is the only way to get the most accurate information
Electronics Forum | Fri Feb 13 13:34:36 EST 2015 | barryg
What would be a recommended way and were to attach therms for profiling on a board with a BGA or BGA's. Evtimov had mentioned drilling a hole and attaching to the BGA? We do not always get sacrificial boards when we do a job. Is attaching to the PCB
Electronics Forum | Mon Feb 16 10:33:58 EST 2015 | rgduval
Drilling a hole, and attaching the thermocouples underneath the part is the recommended way to profile for a BGA, unfortunately. It allows the best method of collecting specific data, including any thermal sinking/shadowing that the BGA creates. Ho
Electronics Forum | Mon Feb 16 13:03:13 EST 2015 | dyoungquist
A good resource for implementing a BGA assembly process is: IPC-7095C Design and Assembly Process Implementation for BGAs Lots of valuable information in that publication.
Electronics Forum | Thu Jan 23 16:59:14 EST 2003 | barry
what are the methods used out there to verify reflow oven performance or machine profiling. What intervals are good practice and is it necessary. We do product pofiles with our profiling equipment and can that be used to base your machine performance
Electronics Forum | Fri Jan 24 16:57:39 EST 2003 | MA/NY DDave
Hi, I will give just one of the couple of ways I have seen. Once a particular product is debugged, verified through the process the profile of the Oven and it's settings are stored on a separate PC. Prior to running that product and at the start of
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