Electronics Forum | Thu Sep 23 08:59:20 EDT 1999 | Wolfgang Busko
| Hiya, | | Could anyone please suggest recommended manufacturers of | IR rework stations for the removal of various SMT comps. | | Cheers | Why IR ? Ok, I�ve seen only one but that thing burnt the PCB before the solder was melting and costs a lo
Electronics Forum | Mon Aug 30 02:41:22 EDT 1999 | Dreamsniper
Planning to evaluate the above process... Can anyone can give me some tips/infos on the above.... e.g. stencil aperture design, aperture ratio, common problems and solutions they encountered on the above process, is the profile different from an ordi
Electronics Forum | Wed Aug 18 11:18:22 EDT 1999 | GREG DENHAM
WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS. IS TH
Electronics Forum | Wed Aug 18 11:25:12 EDT 1999 | J.J. Thomas
| WE ARE CURRENTLY HAVING PROBLEMS REFLOWING BOARDS WITH WHITE TIN PLATING. WE ARE NOT GETTING GOOD WETTING ON THE PADS. | WE HAVE CHECKED THE REFLOW PROFILE AND TRIED DIFFERENT PASTE'S. | WE THINK THERE MAY BE CONTAMINATION OR OXIDATION ON THE PADS.
Electronics Forum | Fri Jul 16 14:36:40 EDT 1999 | ken
Jeff, if you have not already tried this, try a longer, more gradual reflow phase in your profile. This has worked for me to eliminate tombstoning during similar situations where non standard component pads were used. It may provide you a useable a
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Fri Jun 25 09:43:24 EDT 1999 | Dave F
snip | | Dear John/Earl | | Thanks for your clarifications. To me also the problem does not seem to be linked with the PCB. The Pre heater temp. is set at | 450 degree C. We are using Alpha Aq. cleanable flux. Can you elaborate on the Desired
Electronics Forum | Thu Apr 29 22:50:41 EDT 1999 | Kelly Morris
Tombstoning 0805s w/palladium/platinum/silver terminations We are experiencing tombstoning problems on 0805 packages that have paladium/platinum/silver terminations. It comes & goes...... I�ve checked the reflow profile, and paste deposition and a
Electronics Forum | Wed Apr 21 22:15:12 EDT 1999 | Chris
| I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is abo
Electronics Forum | Sun Jun 04 14:14:24 EDT 2000 | James.L
1) Adhesive dispensing -number of dot per component , what's the determined factor ? What's the distribution ? 2) What is the critical factor to monitor the consistacy of volume & profile per dot ? 3) What is the effect of temperature/balance of adhe
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