Electronics Forum | Mon Feb 19 08:18:03 EST 2007 | realchunks
That's why you have to read between the lines of any article. Even with data from a paste manufacturer, it's still a bit fuzzy on how their paste will actually work. Not many companies have their data that solid, so it's better to experiment and me
Electronics Forum | Tue Feb 13 07:54:48 EST 2007 | jax
Smaller Ovens reduce your ability to create extended soak times. Extended Soak Time requirements are determined by your thermal variant across the product. A 5 zone oven could work if your boards are not extremely complex but you are the only person
Electronics Forum | Tue Feb 13 15:20:12 EST 2007 | billyd
Fellas: I'm having a tough time with voiding with my lead free water soluble paste under my large BGAs. I know some is almost inevitable, but this is more than I'd like. This is with a slope of .9, soak of 60 seconds, above 217 for 85 seco
Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Thu Mar 29 08:52:59 EDT 2007 | realchunks
Hi George, Depending on your product, wave soldering twice is not all that bad. Residues will be higher, but should only be cosmetic unless your product is sensitive to ionic contamination. You can set-up an alternate profile on your wave for 're-
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Fri Apr 13 09:41:41 EDT 2007 | aj
All, I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works. Clearly there is an issue with the wetting of some Balls causing a poor connection. My profile looks spot on - I think I poste
Electronics Forum | Wed May 02 06:28:26 EDT 2007 | LC
In our first run, we actually followed the solder paste recommended profile then we were told to use the BGA recommended one. When we had the 2nd run we still got the same problem. We're using Kester 909HPS (lead free) and ENIG boards. Thanks.
Electronics Forum | Wed May 02 10:45:24 EDT 2007 | bartlozie
I agree with Bob, Do you have a long TAL, ENIG needs a longer TAL then other boards, on the side of this, Latest year there are a lot of bad Au plated boards, we had 3 batch of bad plated boards in the last year. indeed maybe the problem isn't the
Electronics Forum | Thu May 03 09:02:31 EDT 2007 | realchunks
Hi LC, Where are you getting your profile from? Are you actually attaching t-couples to the board? For BGAs the best place to measure is from the center of the device. This means drilling a hole in the board and placing the t-couple thru the hole
