Electronics Forum: profiling (Page 271 of 463)

Re: Ceramic + Hi-temp solder

Electronics Forum | Thu Apr 22 08:43:25 EDT 1999 | Michael N.

| | I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is a

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 20:17:41 EST 1999 | Michael Larsen

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using

01005 Qualifications - Lead Free

Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem

Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson

Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 17:30:25 EDT 1999 | Mohammad Yunus

| | | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are

Re: Reflow Oven Capability Study

Electronics Forum | Sat Jul 10 02:47:27 EDT 1999 | Scott

| | | Hi! | | | I'm a process engineer attempting to do a capability study on our existing convection reflow oven - Heller 1500. It was recommended by an independent consultant to do at the very least, load testing, process ready testing, and board

Re: BGA repair/rework

Electronics Forum | Sat Mar 06 12:33:21 EST 1999 | Dean

| | I'm having a fun time between BGA rework/repair using an SRT 1000 and SPC efforts (much easier) using DEK stencil printing processes and BTU reflow with 6 Fuji lines in between. | | Concerning the BGA stuff, I'm getting about 60% success using

Re: Wave Rider

Electronics Forum | Mon Jan 04 11:32:59 EST 1999 | Chrys

| Anyone have any experience with ECD's Waverider/MOLE profiling equipment? If so, were they positive experiences? | I use ECD's mole for profiling in the wave and a KIC for profiling in reflow. I like the KIC a whole lot better for a couple of re

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a

Re: Solderability on Immersion Gold

Electronics Forum | Thu Mar 02 16:06:32 EST 2000 | eLDON sANDERS

Gentlemen, I too have been atacked by that "soldering to gold" and will add my 2 cents. I also had parts that would pop off the board when the fillet looked perfect. After lots of pain, experimentation, and sleepless nights, I solved it through a


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