Electronics Forum | Sat Jun 30 14:17:53 EDT 2001 | stefwitt
I would highly recommend that you test drive your vehicle before you buy it. Buy a test kit from Topline and have a stencil made. Make an appointment with the machine manufacturer and let them know that you come with your own boards and components.
Electronics Forum | Fri Jul 13 19:08:55 EDT 2001 | mparker
Home plate apertures are designed to reduce or eliminate solder balls that occur when placing a chip and reflow of the solder. This aperture type is usually desired when processing with a "no-clean" solder paste. The design of the aperture is usually
Electronics Forum | Thu Jul 26 02:20:37 EDT 2001 | mugen
Hey, hey, hey !!!! why do we always think of the BIG names, eh? give the underdog a chance, manz! We evaluated the METCAL bga rework station, (they only have one model going, no worry, its loaded with smart innovations) we gave it thumbs up, 2 thu
Electronics Forum | Sat Feb 05 09:01:15 EST 2000 | Dave F
JS: The issue is not how efficiently/effectively that you can run your placement machine, probably. The issue is how efficiently you can run that part of your assembly process that is the bottleneck. Other than improving quality, optimizing any pa
Electronics Forum | Sat Jan 15 16:59:47 EST 2000 | Steve Thomas
Thanks, Mark. Actually we already have an established mark. We use 500ppm (99.95%) as our acceptable level. Problem is, someone (another manufacturer) told someone else (our pres.) that THEY build to 50ppm. Soooooo, someone else told my boss that
Electronics Forum | Tue Dec 21 18:09:24 EST 1999 | Brian W.
I have been soldering 0603 components on the bottom side using a glue and wave solder process for a long time. Bridging has not been a common problem. However, it is inherent on the design engineers to follow good manufacturability planning when la
Electronics Forum | Fri Dec 17 16:23:22 EST 1999 | Mike Naddra
Hello Henry, Tombstoning is caused (In most cases) by a force imbalance on either side of the component. As the solder becomes liquidous the surface tension of the liquid will pull the component to the center of the liquidous area. To solve the probl
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Tue Dec 14 11:13:43 EST 1999 | Chris May
Paul, I have (as many have) come across this problem due to misregistration of resist at the PCB fab. You didn't say if these boards are inexpensive double sided or costly multis. I know this shouldn't make a difference on quality but I would tend t
Electronics Forum | Tue Nov 09 17:26:13 EST 1999 | Dave F
Horace: You weren't real specific about the set-up of the two machines. So what's the diff man?? Big dross generators are: 1 R Woodgate says that pump speed is the biggest driver to dross production 2 Chrys uses low dross cast bar: Alpha HiFlo 3
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