Electronics Forum: recommendation (Page 236 of 392)

solder paste(SnPbAg)

Electronics Forum | Mon Aug 04 23:27:05 EDT 2014 | madhuranatha

Let me thank you for the reply. We are manufacturing products which are fitted on the aircraft. We are using SN63Pb37 solder paste for PCB assembly. Of late one of the solder paste supplier recommended SnPbAg for better solder-ability & reliabi

Philips Topaz/Emerald LED Nozzle

Electronics Forum | Mon Dec 29 16:49:57 EST 2014 | emanuel

Hi Rob, I am writing this reply as an update. Unfortunately I got your recommendation a bit too late, I contacted Count-On Tools and ordered from them a custom made nozzle for the Emerald. $300 paid for the "pleasure", everything could be OK if it w

Press fit parts help

Electronics Forum | Tue Oct 14 09:17:09 EDT 2014 | rgduval

You could check the data sheets/web sites from the manufacturers of the press-fit parts. They typically will identify the recommended tooling/equipment necessary to install their components. Generally, pneumatic presses are suggested, with controll

What is the MSL of a PCB

Electronics Forum | Tue Jan 13 15:48:58 EST 2015 | natashakt

170 degrees Celsius) and regular FR4 materials. I am trying to see if we can use table 5 on page 14, "Recommended Equivalent Total Floor Life (Days)" to find out how long (at specific humidity and temperature) our populated and unpopulated PCB's can

Austin American Nanojet System

Electronics Forum | Mon Jan 19 16:27:32 EST 2015 | heath

I was wondering if there are any Austin American Nanojet owners out there who would be willing to share their experiences. We purchased one on the recommendation of someone in the industry, but our experiences is quite different from the "Set it and

Flux thinning

Electronics Forum | Tue Feb 17 09:37:16 EST 2015 | charliedci

We made the same change a year ago, from foam to spray fluxer. One of the reasons we changed, to keep the acid number within specs (foam fluxing) we had to measure once or twice a day and add DI water to make up for evaporation, all along not able to

BGA epoxy removal

Electronics Forum | Tue Mar 24 22:03:39 EDT 2015 | davef

Here's some notes from IPC APEX 2015: * Black underfill is Heraeus. It needs to be preheated to 180-200*C for rework. Above 200*C it changes state and becomes difficult. * Clear underfill is from an unknown Korean supplier. * People from Heraeus w

BGA epoxy removal

Electronics Forum | Wed Mar 25 03:27:13 EDT 2015 | slave2anubis

Hi davef, thank you for sharing this. Yes all manufacturers recommend their products, and i dont deny that they are good but for a small shop like i have i think the prices are a bit high. What i think would be a good technique, is heating the area t

DQFN INSUFFICIENT SOLDER / HEAD ON PILLOW

Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd

So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi

Samsung CP45 File Save Issue

Electronics Forum | Fri May 29 06:07:47 EDT 2015 | buckcho

Hello, it is important to decide to work either with pcb or with opt files (we use only pcb), I dont recommend mixing them. When you open the pcb file, make changes, optimize it to opt file, then make save as.... and here is the trick I know - save t


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