Electronics Forum | Tue Mar 04 03:24:43 EST 2008 | reypal
I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total
Electronics Forum | Thu Sep 04 07:41:35 EDT 2008 | scottp
I happen to agree with Vlad and I'm not in the same business as him. Randomly turning knobs isn't the way to solve a problem. Do a proper analysis and let the parts tell you what's happening. Seems like a lot of problems people post on this forum
Electronics Forum | Wed Aug 27 09:30:22 EDT 2008 | vladig
Hi Eyal, Sure you can do that. You might be able to use your "typical" reflow profile for eutectic, or tweak it slightly. it's a good idea to do a trial run and then get a couple of components cross-sectioned and checked for the microstructure of th
Electronics Forum | Thu May 14 06:55:59 EDT 2009 | davef
While you're waiting for others to reply: * Search the fine SMTnet Archives to find threads like http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=28544 * Checkout Daan Terstegge's excellent jump site http://www.smtinfo.net/Db/_Ball%20Grid%2
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Fri Sep 04 15:33:09 EDT 2009 | martinphill
Is it possible to Process Top & Bottom side PCBA simultaneously in One SMT Line. (An atrticle by Jagadeesh Rajagopalan, SMT Process consultant). Pls check this and suggest me whether it is possible? & What should be the Lead free Reflow Profile? ht
Electronics Forum | Sat Sep 05 23:15:32 EDT 2009 | prasadz
We have successfully implemented this dual Process You can use any printer that supports Board width 500mm. SMT Dual Process Maximum PCB Width should be (500-20 / 2 ) = 240mm Max (PCB width )Printer support = 500mm Top width + Bottom width
Electronics Forum | Thu Oct 01 06:22:48 EDT 2009 | rajeshwara
We approved the Reflow Profile from Cookson Solder Paste Manufacturer we are using. Now I am suspecting on method of vias designing below that QFP.There is exposed pad for that QFP and we print solder paste there , but when i see under x-ray there is
Electronics Forum | Tue Jul 06 08:28:16 EDT 2010 | Sean
Hi all, Recently, we found the IC lead dewetting as shown in the attached file..This problem only happen on particular lead only...We checked our reflow profile and its look everything is fine..We did cross section and EDX..I think this could be mat
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
