Electronics Forum | Mon Aug 07 14:02:54 EDT 2000 | Brian W.
If you are satisfied with the apertures, then you need to check placement pressure, plant humidity, and the reflow profile. If the placement pressure is too great, it will separate minute portions of the solder from the pad. When the solder reflo
Electronics Forum | Tue Oct 30 10:30:24 EDT 2007 | wayne123
how many layer board is it? what kinda temperatures is your oven currently hitting. In our reflow oven I have been using a profile that is the same for the top and bottom at zone 1 111C zone 2 at 164C zone 3 at 161C zone 4 at 208C and zone 5 at 2
Electronics Forum | Mon Dec 13 21:11:53 EST 1999 | Curtis T.
Steve, I have done countless board profiling and oven reflow profiles. Here are the critical factors on you need to address. What is your board surface finish, if it is something like an OSP it will need a good amount of an active (aqueous) flux to
Electronics Forum | Wed Mar 21 20:02:37 EDT 2012 | hegemon
Lead Free in 5 zones is tough sledding. Start with your manufacturers solder reflow profile and calculate your belt speed by looking at the recommended heating time for the solder paste vs. the length of your heated zones. Set your belt speed so tha
Electronics Forum | Tue Jun 27 10:36:45 EDT 2000 | Bill Bannister
We've been experiencing solder balls on 0805 caps. We have modified the reflow profile and had some success, but some balling still persists. The balls always form from under the cap between the lands. I measured the distance between the lands at .03
Electronics Forum | Wed Feb 21 20:01:39 EST 2001 | davef
I�m unclear about the intent of your question, but I�ll take a pass at it regardless. I second the previous poster's commets. [Ya, that's the ticket.] Most chip attach adhesives should not be cured at typical reflow profile temperatures. Check yo
Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Tue Jan 04 19:55:46 EST 2000 | Rob Thomas
Hello Yosef, non woven aramid reinforced pcb's are used where is a need for low CFT (coefficient of thermal expansion). Traditionally aramid pcb's were used in military applications in order to reduce the stress/failure rate of solder joints during
Electronics Forum | Fri Jul 16 22:44:27 EDT 1999 | Vic Lau
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
