Electronics Forum | Mon Oct 04 11:23:55 EDT 1999 | Mark D.
Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Thu Mar 05 16:25:27 EST 1998 | Brian Stumm @ ETS
| I am looking for information on reflow temps for a flex board. There is only one 6 pin IC but the board has a 3M double sided tape. | Is it possible to reflow without damaging the tape. Any suggestions? Do you have a profiler for your reflow oven?
Electronics Forum | Thu Jan 18 12:07:52 EST 2007 | tonang
How to problem solved about production reject IC short? Please advice us about setting screen mask printer, stering solder paste, profile reflow etc Thank you for your attention and cooperation Best regard, Tonang
Electronics Forum | Wed Nov 10 10:41:57 EST 2010 | esoderberg
subject board fabrication calls for .05 -.125um of gold over 2 - 5 um of nickel. When doing double sided reflow using same profile, parts of the gold are tarnishing and causing test pad failures. any ideas as to the cause?
Electronics Forum | Fri Dec 01 13:30:08 EST 2017 | kojotssss
Stencil thickness is 4 mil. Via's are plugging from bottom. Gas may be developed under the component? Take Reflow Ovens Thermal Profiling changes? In your opinion?
Electronics Forum | Sun May 10 02:38:15 EDT 1998 | Bob Willis
I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hope
Electronics Forum | Tue May 19 14:59:51 EDT 1998 | Dave F
| I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hop
Electronics Forum | Tue Apr 25 12:29:35 EDT 2006 | Rob
Hi TMC, It's very unlikely that you'll get a temperature variation of 32 degrees by varying the top and bottom heaters - especially if it's forced air convection, as if it's a half decent system the hot air will be circulating in the zone, pretty qu
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
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