Electronics Forum: reflow and profil (Page 76 of 306)

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

SMT Line and vibration next door

Electronics Forum | Mon Jan 13 14:44:19 EST 2020 | dwl

I wouldn't think the vibration from weights dropping would be significant enough to effect the SMT machines. If you are concerned, look into placing vibration dampening pads under the machine feet. you don't need anything fancy, just neoprene pads wo

Pin in paste connectors and lead-free questions

Electronics Forum | Mon Jul 22 09:53:13 EDT 2019 | kylehunter

Hey all! As background, I recently purchased a full SMT line for my company. We have a DEK 265, an assembleon opal xii, and a Heller 1500. Currently our jobs are leaded, and the heller is working perfectly. An upcoming job that we are potentially g

Re: CuOSP and IMM Silver versus HASL

Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.

Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton

Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29

Component pad design and volume requirements

Electronics Forum | Tue Feb 15 14:35:41 EST 2000 | Balas

hi I am designing a test vehicle with a range of components on it(pbga, cbga,fc, mbga, and qfps). My concern is that I would like to use a single stencil for solder deposition and not a stepped stencil. That would require me to have aperture design a

Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 15:38:27 EST 1999 | Wendy Casker

Hi, I am looking for land patterns for 0612 and 0508 chip capacitors. Because they are not standard (yet) package sizes, i am having trouble finding a standard land pattern. (If you don't know what these are, picture a 1206 or an 0805 with the te

Re: BGA rework station and x-ray inspector

Electronics Forum | Wed Jul 22 13:57:03 EDT 1998 | bill

| | We need BGA rework station and x-ray inspector recently in urget case, Do you have any information to rework FPGA package and inspect them during processing. | Thx for any information | Best Regards, | Stoney Tsai If you are doing any reballing

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Wed Jul 31 14:08:22 EDT 2002 | Dave G

Used this paste on ENIG boards W/O N2 and had very good results. (0402's,BGA's,16mil FP) Never had the need to use N2 with this paste on our products. Running with N2 shouldn't hurt anything. The wetting properties should get even better than they ar

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i


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