Electronics Forum: reflow and profile (Page 211 of 306)

Re: Bottomside smt falling off in wave in only voc-free flux

Electronics Forum | Tue Jun 15 12:03:27 EDT 1999 | Dave F

| Has anyone had issues where bottomside double reflowed smt has fallen off in the wave when using voc-free flux? I have verified the hotter profile was not the issue by using an alcohol based flux with no problems.This voc-free flux is also not caus

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper

| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua

lead free joint finish

Electronics Forum | Thu Jan 29 16:51:57 EST 2009 | gregoryyork

Hi Small ovens work fine if the settings are correct and I seriously doubt 55cm/min is right. Profile it and speed down to around 35cm/min. Increase first zone to around 170 keep second at 208 but increase last to around 280 BUT profile to check it

Re: BGA PROFILE

Electronics Forum | Tue Feb 02 14:53:56 EST 1999 | Tony

| Hi everybody. | Somebody know any consideration or special care to make a profile for BGA's. | | any advice is aprecied. | | thanks | Al Carrillo | | | | Al, I have been using the same process as Justin recomendations. I have been verry su

PLCC LEADS not solder in SAC305 paste

Electronics Forum | Thu Jun 28 09:54:06 EDT 2012 | mosborne1

Dave, They rework fine. All solder joints on the whole board look great especially for lead free sac305. Here are the reflow specs: SAC305 no clean solder paste – Kester EM907 Kic thermal profiling device – 50%process window green light profile. • M

FR4 boards Delamination Cause?

Electronics Forum | Wed May 07 17:52:36 EDT 2008 | wayne123

I have these boards that are a four layer FR4 material, we had been running them for quite awhile with no trouble, and then they started delaminating, I checked my Reflow oven profile and I was barely hitting the temps required for our paste, we then

Profile control parameters

Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef

Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A

Re: Component Thermal Profiles

Electronics Forum | Tue Jun 08 10:01:34 EDT 1999 | John Thorup

| Can anyone please help me locate details on maximum allowable temperatures of components when passing through a reflow oven. | | I think I want the thermal profile for the part, or a source or standard which will allow me to check if I can safely

Lead Based Paste / Lead-Free BGA

Electronics Forum | Thu Nov 03 10:33:04 EST 2005 | Samir Nagheenanajar

I've read all the SMTNet threads available on this topic, been to a couple seminars, and read some articles, and the general consensus seems to be "it can be done, but shouldn't." However, at my company, we have a Pb-Free (SAC alloy) 256 IO BGA comi

blackened/black solder

Electronics Forum | Wed Mar 28 14:11:19 EDT 2007 | pjc

It should only be a visual thing. What may be happening is that all the thermal energy being driven into the wave solder pallet to get good soldering is causing the no-clean residues to burn up a bit, causing the discoloring. Check to see if they hav


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