Electronics Forum: reflow and profile (Page 216 of 305)

Re: Poor Solder on TSOP

Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin

| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E

Re: Solder on GF

Electronics Forum | Tue Jul 13 19:00:29 EDT 1999 | JohnW

| Hi All, | Does any one experienced the solder on gold finger after | reflow. Its about 5 to 8 mils diameter . | We'd clean the entire screen printer, mounter & reflow as well, | but doesn't help much. | | Mr Kong..... Solder on gold is a age old

Re: Solder on GF

Electronics Forum | Wed Jul 14 10:58:25 EDT 1999 | Upinder Singh

| | Hi All, | | Does any one experienced the solder on gold finger after | | reflow. Its about 5 to 8 mils diameter . | | We'd clean the entire screen printer, mounter & reflow as well, | | but doesn't help much. | | | | | Mr Kong..... | | Solder

Re: solder balls on high temp.solder

Electronics Forum | Tue Dec 12 03:15:13 EST 2000 | Chris May

The profile that you should be using, hopefully, is detailed in the paste data sheet. Connect your thermocouples to various parts of the board, depending on layout, population etc; and then run some trials observing the profile on your oven monitor/

Lead free Solder Paste & Use of nitrogen

Electronics Forum | Mon Jul 29 19:39:57 EDT 2013 | hegemon

No problem running lead free without nitrogen. Careful profiling will take care of the soldering. Cosmetically, the Nitrogen reflow is superior for lead free, and we see much better wetting, better coverage of the PWB pads, and of course the smooth

Problems with TI DSP modules

Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef

WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall

Re: double sided step by step

Electronics Forum | Tue Oct 05 03:49:04 EDT 1999 | Chris May

| Hi everyone, I need some help on the whole process of double sided surface mount. We have been doing surface mount for about 3 months and we're getting ready to take on our first doule sided board. I just need some step by step process regarding so

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:31:27 EDT 2005 | russ

Not in this case, these BGAs were lead free and the profile used was for a lead part. I guess I will give you the whole story. These boards were sent to us from a customer to have the BGAs replaced for an unknown to us reason. We removed the parts

Reflow Oven

Electronics Forum | Tue Aug 13 10:49:20 EDT 2019 | sankarseptember

It Satisfy Profile Condition

Reflow process

Electronics Forum | Thu Jun 12 03:34:23 EDT 2003 | sanjeevc

I would like to ask a question about SMT reflow > process. I did 10 pcs samples but all is fail. > The sample is double faces to have components > (up-side has 4 pcs of BGA and down-side has 3 BGA > and 2 QFP). And I saw some of BGA which is > t


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