Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an
Electronics Forum | Wed Mar 27 07:41:54 EST 2002 | paul_stamper
As Mitchell stated before, the cleaning of the stencil is rather important. When considering stenciling of adhesive you must review your stencil cleaning process. The recomended process is a ultrasonic cleaner with a heater option. These systems are
Electronics Forum | Sun May 10 02:38:15 EDT 1998 | Bob Willis
I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hope
Electronics Forum | Tue May 19 14:59:51 EDT 1998 | Dave F
| I have just updated my web site www.bobwillis.co.uk and there are a number of BGA documents which may be of interest to SMT Engineers. Guidlines on design, inspection, rework, solder finishes and three FAQ sections on BGA, Reflow and Profiling. Hop
Electronics Forum | Tue Apr 25 12:29:35 EDT 2006 | Rob
Hi TMC, It's very unlikely that you'll get a temperature variation of 32 degrees by varying the top and bottom heaters - especially if it's forced air convection, as if it's a half decent system the hot air will be circulating in the zone, pretty qu
Electronics Forum | Fri Sep 10 15:15:09 EDT 2021 | majdi4
Hello to all , Could you help with this defect .. Tombstoning 0201 , always at the same place in board , only this component near to the coax connector..with a defect rate of 2 % ..All the process is perfect . i cheked : stencil design , SPI resul
Electronics Forum | Mon Jul 01 16:00:43 EDT 2024 | cyber_wolf
"When I need more heat for larger thermal mass, I no longer have to worry about balancing slower belt speed with higher temperature." Robin, so you have a method to use the same heater set points and belt speeds used on a .018" flex board and for 1/
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Tue Oct 06 17:17:44 EDT 1998 | Chrys
| We are experiencing poor wetting on various components placed on a PCB with En-Tek coating. Is anyone else experiencing simular problems ? We have the following questions: | | 1. How can the thickness of the En-tek coating be measured? | 2. Is En
